Substrate testing system

Abstract

The invention is applicable to the technical field of testing and discloses a substrate testing system. The substrate testing system comprises a control host, an integrated circuit tester, a driving device, a probe card and a testing platform; wherein the control host sends an automatic test start signal to the driving device, so that the driving device drives the testing platform to reach a testposition, and the integrated circuit tester conducts electrical performance testing on the substrate through the probe card contacting the substrate at the test position and sends test data to the control host. When the electric performance test of all the areas of the substrate is completed, the driving device drives the testing platform to return to the initial position, otherwise, the next region test continues to be carried out until all the regions of the substrate are tested. A full-closed test method is adopted, so that the automatic test of the electrical performance data of a substrate product is realized. The performance is stable, The operation is simple, and the function is complete, so that the problem that the functions of substrate testing equipment in the prior art are incomplete is solved.

Description

technical field [0001] The invention belongs to the technical field of testing, in particular to a substrate testing system. Background technique [0002] With the rapid development and innovation of electronic technology, integrated circuits have been widely used in various industries, and the packaging forms of integrated circuits are also various. As a new packaging form, integrated circuit substrate packaging has this kind of packaging technology in all major packaging factories in China. However, due to the immature technology, substrate packaging still has the following characteristics: First, there is no unified packaging in the industry Therefore, the dimensions of different substrates and the size of the IC (integrated circuit) chip on the substrate are inconsistent; the second is that the substrate is easily deformed during the packaging process, and there is no unified industry standard, and each packaging factory uses its own mold and production process , so the...

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Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a substrate testing system, aiming to solve the problem of imperfect functions of substrate testing equipment in the prior art

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