Computer heat dissipation device

Abstract

The invention discloses a computer heat dissipation device, which comprises a computer case, heat dissipation holes, a refrigerator, a first L-shaped pipe, an air blower, a bracket, a second L-shapedpipe, a horizontal pipe, a first lantern ring, a vertical pipe, a second lantern ring, a first motor, a rotary block, a cross bar, a sliding block, a round sliding block, a second motor, a vane, a pore plate, a barrel body, a T-shaped chute, a T-shaped sliding block, a cross plate, a first spring, a vertical plate, a rubber sleeve, an expansion link, a second spring, a chute, an electric wire anda plug, wherein the bottom surface of the computer case is provided with the barrel body. The device is easy in operation and can quickly carry out heat dissipation, cold air is blown out of the pipeto blow air to a computer component so as to quickly take heat on the component away, in addition, the rotary block is arranged, so that the computer component can receive air in an omnibearing way, and in addition, air can be evenly blown. The first spring and the second spring are arranged, omnibearing vibration reduction can be realized, components in the computer case can be effectively guaranteed, a purpose that the computer is used for a long time is achieved, and the service life of the computer is prolonged.

Description

technical field [0001] The invention relates to the field of electric appliances, in particular to a cooling device for a computer. Background technique [0002] A large number of integrated circuits are used in the components of the computer. Although the computer is light and small in size, the smaller size causes the computer to generate a lot of heat. If the heat generated by the operation of the integrated circuit is not removed in time, it will affect the operation of the computer. , Most radiators absorb heat through contact with the surface of the heating component, and then transfer the heat to a distant place through various methods. The traditional heat dissipation device cannot quickly dissipate the heat, but only fixedly dissipates heat to a certain part, and the heat dissipation area is small. The purpose of uniform and timely heat dissipation cannot be achieved. Contents of the invention [0003] In order to solve the above existing problems, the present in...

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Problems solved by technology

[0002] A large number of integrated circuits are used in the components of the computer. Although the computer is light and small in size, the smaller size causes the computer to generate a lot of heat. If the heat generated by the operation of the integrated circuit is not removed in time, it will affect the operation of the computer. , Most radiators absorb heat through contact with the surface of the heating component, and then transfer the heat to a distant place through various methods. The traditional heat dissipation device cannot quickly dissipate the heat, but only fixedly dissipates heat to a certain part, and the heat dissipation area is small. Unable to achieve uniform and timely heat dissipation

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