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Production method of fine circuit of single-sided COF flexible substrate and product obtained through production method

A flexible substrate and fine circuit technology, which is applied in the production of COF single-sided flexible substrate fine circuit and its products, can solve the problem that the minimum line width/line spacing does not reach 10 microns, etc.

Active Publication Date: 2018-11-02
MFLEX YANCHENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the companies that have mastered the production technology of COF flexible substrates and have the conditions for mass production are concentrated in South Korea, Japan, and Taiwan, China. Individual domestic companies have the production capacity of using etching methods to produce single-sided COF flexible substrates, but the minimum line width / space Did not reach the level of 10 microns / around 10 microns

Method used

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  • Production method of fine circuit of single-sided COF flexible substrate and product obtained through production method
  • Production method of fine circuit of single-sided COF flexible substrate and product obtained through production method
  • Production method of fine circuit of single-sided COF flexible substrate and product obtained through production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The fine circuit of COF single-sided flexible substrate is made by the following steps:

[0029] (1) Dry film lamination: a metal Ni / Cr layer 2 with a thickness of 20 nanometers is set on the upper surface of the polyimide lower layer 1, and a copper layer 3 with a thickness of 1 micron is set on the upper surface of the metal Ni / Cr layer 2 Make the substrate, and form a dry film with a thickness of 15 microns by vacuum pressing on the upper surface of the copper layer 3;

[0030] (2) UV exposure of dry film: cover the glass negative on the dry film, the glass negative includes transparent areas and black areas spaced one by one in the X direction, the size of each transparent area in the X direction is 5 microns, each black The X-direction size of the area is 9 microns. Use ultraviolet rays to irradiate and expose the dry film covered with the glass negative film and then remove the glass negative film. The part covered by the transparent area on the dry film is the ex...

Embodiment 2

[0038] The difference from Example 1 is: in step (2), the X-direction dimension of each transparent area and dry film exposed portion 4 is 4 microns, and the X-direction dimension of each black area and dry film unexposed portion is 10 microns. Micron.

Embodiment 3

[0040] The difference from Example 1 is: in step (1), the thickness of copper layer 3 is 0.5 micron; in step (2), the X-direction size of each transparent area and dry film exposure part 4 is 6 microns, each Both the black area and the unexposed portion of the dry film had an x-dimension of 8 microns.

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Abstract

The invention provides a production method of a fine circuit of a single-sided COF flexible substrate. The production method comprises the following steps of (1) laminating a dry film; (2) carrying out ultraviolet exposure on the dry film; (3) developing the dry film; (4) carrying out copper electroplating; (5) stripping the dry film; (6) etching a copper layer on a substrate; and (7) etching a metal Ni / Cr layer. The invention further provides a product obtained through the production method. By adopting a semi-addition process, the fine circuit of the single-sided COF flexible substrate of which the copper thickness is about 10 microns and the line width / line distance reaches 7 microns / 7 microns can be produced by using a high-precision glass negative and the dry film with high adhesion and high resolution.

Description

technical field [0001] The invention relates to a method for manufacturing a fine circuit of a COF single-sided flexible substrate and a product thereof. Background technique [0002] COF (Chip on film, chip on film technology), is to mount the chip on a flexible film substrate to realize the output of the chip I / O, and is widely used in the panels of mobile phones, TVs, ipads and other electronic products. At present, most of the companies that have mastered the production technology of COF flexible substrates and have the conditions for mass production are concentrated in South Korea, Japan, and Taiwan, China. Some domestic companies have the production capacity of using the etching method to produce single-sided COF flexible substrates, but the minimum line width / line spacing It has not reached the level of 10 microns / around 10 microns. With the rise of OLED in the panel industry, the demand for COF flexible substrates will increase. The difficulty of COF flexible subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0082H05K3/06H05K2203/052
Inventor 刘清万克宝张俊杰
Owner MFLEX YANCHENG CO LTD
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