A kind of manufacturing method and product of cof single-sided flexible substrate fine circuit

A flexible substrate, manufacturing method technology, applied in the exposure method of radiation-sensitive mask, printed circuit manufacturing, removing conductive material by chemical/electrolytic method, etc., can solve the minimum line width/line spacing not reaching 10 microns, etc. question

Active Publication Date: 2020-02-07
MFLEX YANCHENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the companies that have mastered the production technology of COF flexible substrates and have the conditions for mass production are concentrated in South Korea, Japan, and Taiwan, China. Individual domestic companies have the production capacity of using etching methods to produce single-sided COF flexible substrates, but the minimum line width / space Did not reach the level of 10 microns / around 10 microns

Method used

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  • A kind of manufacturing method and product of cof single-sided flexible substrate fine circuit
  • A kind of manufacturing method and product of cof single-sided flexible substrate fine circuit
  • A kind of manufacturing method and product of cof single-sided flexible substrate fine circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] COF single-sided flexible substrate fine lines are made by the following steps:

[0029] (1) Dry film lamination: a metal Ni / Cr layer 2 with a thickness of 20 nanometers is arranged on the upper surface of the polyimide lower layer 1, and a copper layer 3 with a thickness of 1 micrometer is arranged on the upper surface of the metal Ni / Cr layer 2 A base material is made, and a dry film with a thickness of 15 microns is formed by vacuum pressing on the upper surface of the copper layer 3;

[0030] (2) UV exposure of dry film: cover the glass negative film on the dry film, the glass negative film includes a transparent area and a black area spaced apart in the X direction, the X dimension of each transparent area is 5 microns, and each black area is 5 microns. The X dimension of the area is 9 microns. The dry film covered with the glass negative is irradiated and exposed by ultraviolet rays, and the glass negative is removed. The part covered by the transparent area on th...

Embodiment 2

[0038] The difference from Example 1 is: in step (2), the X dimension of each transparent area and the dry film exposed part 4 is 4 microns, and the X dimension of each black area and the dry film unexposed part is 10 μm. microns.

Embodiment 3

[0040] The difference from Example 1 is: in step (1), the thickness of the copper layer 3 is 0.5 microns; in step (2), the X dimension of each transparent area and the dry film exposure part 4 is 6 microns, and each Both the black area and the unexposed portion of the dry film had an X dimension of 8 microns.

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Abstract

The invention provides a production method of a fine circuit of a single-sided COF flexible substrate. The production method comprises the following steps of (1) laminating a dry film; (2) carrying out ultraviolet exposure on the dry film; (3) developing the dry film; (4) carrying out copper electroplating; (5) stripping the dry film; (6) etching a copper layer on a substrate; and (7) etching a metal Ni / Cr layer. The invention further provides a product obtained through the production method. By adopting a semi-addition process, the fine circuit of the single-sided COF flexible substrate of which the copper thickness is about 10 microns and the line width / line distance reaches 7 microns / 7 microns can be produced by using a high-precision glass negative and the dry film with high adhesion and high resolution.

Description

technical field [0001] The invention relates to a method for manufacturing a fine circuit of a COF single-sided flexible substrate and a product thereof. Background technique [0002] COF (Chip on film, chip-on-film technology) is to mount a chip on a flexible film substrate to realize the output of chip I / O. It is widely used in the panels of electronic products such as mobile phones, TVs, and iPads. At present, most of the companies that master the production technology of COF flexible substrates and have the conditions for mass production are concentrated in South Korea, Japan and Taiwan, China. Some domestic enterprises have the production capacity of using the etching method to make single-sided COF flexible substrates, but the minimum line width / line spacing Not to the level of 10 microns / 10 microns or so. With the rise of OLED in the panel industry, the demand for COF flexible substrates will increase. The difficulty of COF flexible substrates is that the line width...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0082H05K3/06H05K2203/052
Inventor 刘清万克宝张俊杰
Owner MFLEX YANCHENG CO LTD
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