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Device and method for detecting bonding defects of conductive composite materials

A conductive composite material and composite material technology are applied in the field of non-destructive testing devices, which can solve the problems of complex conductive composite materials and achieve the effect of solving detection problems.

Active Publication Date: 2022-03-22
EDDYSUN (XIAMEN) ELECTRONICS CO LTD
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AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art, provide a device and method for detecting bonding defects of conductive composite materials, and use acoustic and electromagnetic sensors to solve the problem of complex bonding defect detection of conductive composite materials

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  • Device and method for detecting bonding defects of conductive composite materials

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Embodiment Construction

[0013] Examples such as figure 1 As shown, a device for detecting bonding defects of conductive composite materials includes a vibroacoustic electromagnetic eddy current integrated sensor 1, an acoustic vibratory detector 2, and an electromagnetic eddy current detector 3, and is characterized in that: the acoustic vibratory electromagnetic eddy current integrated sensor 1 consists of The acoustic vibration detection probe 10 is integrated with the electromagnetic eddy current detection probe 11, and the detection surface of the acoustic vibration detection probe 10 is adjacent to the detection surface of the electromagnetic eddy current detection probe 11; the acoustic vibration detector 2 is integrated with the acoustic vibration electromagnetic eddy current integrated sensor 1 The vibration-acoustic detection probe 10 is electrically connected, and the vibration-acoustic detector 2 excites the excitation signal of power change; the electromagnetic eddy current detector 3 is e...

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Abstract

The invention discloses a device and method for detecting bonding defects of conductive composite materials, including an acoustic-vibration electromagnetic eddy current integrated sensor, an acoustic-vibration detector, and an electromagnetic eddy current detector. The combination of acoustic and electromagnetic sensors is used to effectively solve the problem of conductive composite materials. The Detection Dilemma of Critical Bonding Defects.

Description

technical field [0001] The invention relates to a non-destructive testing device and method, in particular to a conductive composite material bonding defect detection and method. Background technique [0002] At present, the detection of bonding defects of composite materials usually uses acoustic detection methods to detect the bonding quality. Due to the wide variety of bonding defects, some special critical bonding defects are difficult to detect. The critical bonding defects are static Adhesion, a defect in a bond that separates under vibration of a certain intensity. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a device and method for detecting bonding defects of conductive composite materials, which uses acoustic and electromagnetic sensors to solve the problem of complex bonding defect detection of conductive composite materials. [0004] The technical solution adopted by the pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/9093G01N27/9013G01N29/04
CPCG01N27/9013G01N29/048G01N2291/0231G01N27/9006
Inventor 林俊明郭奇赵晋成
Owner EDDYSUN (XIAMEN) ELECTRONICS CO LTD