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Chip burning positioning method for accurate positioning and burning device

A technology of precise positioning and positioning method, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficult positioning of chips, programming errors, chip position offsets, etc., and achieve the effect of avoiding programming failures

Active Publication Date: 2018-11-06
GUANGZHOU MINGSEN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Specifically, after the chip enters the chip groove, the negative pressure device stops providing negative pressure, and under the action of gravity, the chip is separated from the suction head, thereby staying in the chip groove, and then the suction head is away from the chip groove; The chip is small in size and light in weight, and has a certain adhesive force with the suction head, so after the negative pressure stops, the chip may shift in position at the moment when it is separated from the suction head, or fall off after the suction head rises to a certain height. In this way, it is difficult for the chip to be accurately positioned in the smaller volume chip slot, which easily leads to programming errors

Method used

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  • Chip burning positioning method for accurate positioning and burning device
  • Chip burning positioning method for accurate positioning and burning device
  • Chip burning positioning method for accurate positioning and burning device

Examples

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Embodiment Construction

[0040] In order for those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described below in conjunction with the examples and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0041] see Figure 1-7 In this embodiment, the programming device for realizing the above-mentioned chip programming and positioning method includes a programming seat and a driving mechanism for driving the programming seat to open; wherein, the programming seat includes a The fixed seat 1 and the movable seat 2 that can move up and down relative to the fixed seat 1; the movable seat 2 is a hollow structure, and is set on the outside of the upper end of the fixed seat 1, and a plurality of compression springs 3 are arranged between the lower end and the bottom plate 15; The upper end surface of the fixing seat 1 is provided with the chip groove 1-1, and the two sides of the chip g...

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Abstract

The invention discloses a chip burning positioning method for accurate positioning and a burning device. The chip burning positioning method comprises the following steps: using a driving part to drive a chip groove, away from a burning seat, of clamping claws; using the suction head of a transferring mechanism to transfer chips into the chip groove; using the driving part to release the clampingclaws, resetting the clamping claws, and clamping the chips into the chip groove; and using the suction head to release the chips and get away from the chip groove. The burning device comprises the burning seat and a driving mechanism, wherein the burning seat comprises a fixed seat and a movable seat; the chip groove is formed in the upper end face of the fixed seat, and the clamping claws are arranged on two sides of the chip groove respectively; each clamping claw is provided with a clamping part; and when the two clamping parts act on the chips, the width of a gap between the two clampingparts is greater than that of the suction head, used for putting the chips into the chip groove, positioned at the position of the gap. According to the chip burning positioning device and the burningdevice, the chips can be positioned into the chip groove of the burning seat accurately, and a burning fault caused by chip dislocation is avoided.

Description

technical field [0001] The invention relates to chip processing equipment and methods, in particular to a chip programming positioning method and a programming device for precise positioning. Background technique [0002] With the development of information technology, many products are equipped with chips, wherein, before the chip is used in practice, corresponding data needs to be burned into the chip by a chip burner. Generally, in the process of programming, the chip needs to be placed in the chip groove of the programming socket, fixed by the programming socket, and then the programming is carried out. The bottom end extends upwards into the chip slot so that reading and writing tasks can be performed on the chip. [0003] When the transfer mechanism transfers the chip to be programmed to the top of the programming seat, driven by the driver, the programming seat is in an open state, that is, the clamping claws are far away from the chip to avoid the chip, and then the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/683
CPCH01L21/68H01L21/6838Y02P70/50
Inventor 王开来袁孟辉吴伟文
Owner GUANGZHOU MINGSEN TECH CO LTD