Three-dimensional microwave component testing device

Abstract

The invention provides a three-dimensional microwave component testing device, and the device a radio frequency connector and a low-frequency connector. The radio frequency connector and the low-frequency connector are fixedly disposed on a metal frame. The device also comprises a microwave box body which is used for realizing the relative fixing of the metal frame and a microwave circuit. The radio frequency connector comprises a metal housing and a first metal pin, wherein the first metal pin is divided into two segments: a metal pin segment A1 and a metal pin segment B1, and the two segments are connected by a first conductive elastic member. Compared with the prior art, the device enables high-frequency and low-frequency signals to be vertically connected from the bottom of a box bodyto the top of the box body according to the requirements of the characteristics of a three-dimensional microwave component integrated architecture and the electrical performances, can accurately testa radio frequency, can adjust a tested circuit in a testing process, remarkably improves the testing efficiency and accuracy, and solves problems that the testing efficiency of a three-dimensional microwave component is low and the testing of the three-dimensional microwave component is complex.

Description

technical field [0001] The invention relates to a three-dimensional microwave component testing device and relates to the field of microwave testing. Background technique [0002] The RF and LF signals of traditional two-dimensional microwave components are input / output from the side wall of the cavity, and various connectors such as SMA, SMP, and micro-rectangular can be used for testing. However, three-dimensional microwave components adopt a three-dimensional structure with small longitudinal dimensions, higher integration and packaging efficiency than two-dimensional structures, and smaller volumes. Signals are input / output from the vertical plane of the cavity. Connectors cannot be tested directly, so new test fixtures and methods are needed to complete the electrical performance test of tile microwave components. [0003] In his master's thesis "Research on Design and Optimization Method of 3D SoC Test Structure", Wang Shuai mainly expounded the test method of 3D chip...

AI Technical Summary

Problems solved by technology

However, three-dimensional microwave components adopt a three-dimensional structure with small longitudinal dimensions, higher integration and packaging efficiency than two-dimensional structures, and smaller volumes. Signals are input / output from the vertical plane of the cavity. Connectors cannot be tested directly, so new test fixtures and methods are required to complete the electrical performance test of tile microwave components

[0003] In his master's thesis "Research on 3D SoC Test Structure Design and Optimization Method", Wang Shuai mainly expounded the test method of 3D chips, but did not mention the test of 3D microwave components.

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