Medium-frequency plasma cleaning device

Abstract

The invention discloses a medium-frequency plasma cleaning device. The device comprises an air inlet device, a plasma generating device, a vacuum chamber and a gas pumping pipeline, wherein the gas inlet device comprises an air inlet, an MFC mass flowmeter and an electromagnetic valve; the plasma generating device comprises a positive and negative electrode and a PWM pulse width modulation power source, wherein the positive and negative electrode comprise an electrode binding post, an electrode mounting plate and an electrode tray; the vacuum chamber comprises a window flange, a vacuum cavitydoor and a vacuum cavity; and the electrode binding post adopts a crocodile mouth type socket design. According to the medium-frequency plasma cleaning device, the excellent crocodile mouth type socket design is designed, so that rapid plugging can be achieved; and the contact is better than the contact with an electrified electrode, the clamping and pulling function is achieved, the high-energy active ion concentration of electrons, ions and the like are prone to be controlled, so that the more appropriate ions and active free radical ratio are obtained, the controlling of the target reactionis facilitated, the purposiveness and zero damage cleaning of a PCB plate and a FPC are realized.

Description

technical field [0001] The invention belongs to a device for cleaning PCB boards and FPCs, in particular to an intermediate frequency plasma cleaning device. Background technique [0002] Plasma cleaning has gradually been widely used in semiconductor manufacturing, microelectronic packaging, integrated circuits and other industries. The so-called plasma cleaning is to use plasma to treat the surface of the workpiece through chemical or physical action, so as to realize the removal of stains at the molecular level and improve the surface activity. However, in the conventional plasma cleaning process, the workpiece to be cleaned is in the plasma ionization area. The cleaning process is accompanied by the physical cleaning process. High-energy active ions such as electrons and ions in the plasma will cause great damage and thermal effects on the surface of the material. , causing damage to the handling parts. [0003] This plasma device is different from the traditional plas...

AI Technical Summary

Problems solved by technology

However, in the conventional plasma cleaning process, the workpiece to be cleaned is in the plasma ionization area. The cleaning process is accompanied by the physical cleaning process. High-energy active ions such as electrons and ions in the plasma will cause great damage and thermal effects on the surface of the material. , causing damage to the handle

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