Manufacturing process of 6-layer microphone embedded circuit board with embedded chip
A technology of embedded chip and manufacturing process, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of limiting the space expansion and utilization rate of terminal products, and achieve favorable expansion, low cost investment, and improvement effect. Effect
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[0033] A preferred embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. However, the scope of protection of the present invention is not limited to the following examples, that is, any simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the description are still within the scope of the patent of the present invention.
[0034] refer to Figure 1-7 , is a 6-layer microphone embedded circuit board manufacturing process for an embedded chip of the present invention, comprising the following steps:
[0035] Step 1, preparing a four-layer embedded substrate 1 that has been laminated and etched twice;
[0036] Step 2: Expose the double-sided laminated dry film of the four-layer embedded capacitor substrate, etch out the sub-outer layer pattern, and reserve the corresponding preset chip position on an outer layer copper foil of the four-layer embedded ca...
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