Double-side exposure machine and double-side exposure method

A technology of double-sided exposure and exposure area, which is applied in the direction of photomechanical equipment, microlithography exposure equipment, photolithography exposure device, etc., can solve the problems of increasing exposure process, alignment accuracy affecting exposure accuracy, and affecting exposure effect, etc.

Inactive Publication Date: 2018-11-27
ZHONGSHAN AISCENT TECH
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  • Description
  • Claims
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Problems solved by technology

[0003] However, when the laser direct writing exposure machine performs double-sided exposure, it needs to perform flipping operation, and the flipping operation will inevitably cause the problem of alignment after flipping, which not only increases the exposure process, but also affects the exposure accuracy due to the alignment accuracy problem. thus affecting the final exposure effect

Method used

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  • Double-side exposure machine and double-side exposure method
  • Double-side exposure machine and double-side exposure method
  • Double-side exposure machine and double-side exposure method

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Embodiment Construction

[0030] Embodiments of the present invention are described in detail below in conjunction with accompanying drawings:

[0031] It should be noted that when an element is “fixed” to another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the descrip...

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Abstract

The invention relates to a double-side exposure machine and a double-side exposure method. The double-side exposure machine comprises: a mounting frame; first and second exposure components arranged oppositely and capable of moving along the mounting frame; first and second stages capable of moving along the mounting frame. The double-side exposure method is applied to the double-side exposure machine. The first exposure component and the second exposure component form a first exposure zone in a first moving state; the first stage moves in the first exposure zone and performs exposure on a first part to be exposed; the second stage carries a second part to be exposed and forms a second exposure zone when in second moving state; the second stage moves in the second exposure zone and performs exposure on the second part to be exposed, and meanwhile, the first stage unloads or loads a next first part to be exposed; front and back exposure can be achieved with no need for reversing, and inaddition, the time of an exposure process is fully utilized, exposure efficiency is improved, and automatic operation can be achieved.

Description

technical field [0001] The invention relates to the technical field of double-side exposure, in particular to a double-side exposure machine and a double-side exposure method. Background technique [0002] Traditional double-sided exposure machines usually use film transfer printing to expose double-sided circuit boards. Before exposure, it is necessary to make the film with the pattern to be transferred; then, fix the film with the pattern on both sides on the upper and lower glass respectively; then, sandwich the circuit board with the pattern to be transferred between the upper and lower glass, use The blue-violet high-brightness light source is used for exposure, and the circuit pattern is transferred to the circuit board to complete the double-sided exposure. For laser direct writing exposure machines, single-side exposure is usually used. Firstly expose one side of the circuit board, turn it over after the exposure is completed, then expose the other side of the circ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/2022
Inventor 汪孝军廖平强张胜
Owner ZHONGSHAN AISCENT TECH
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