16results about How to "Improve exposure efficiency" patented technology

The invention relates to the technical field of pressure-sensitive adhesives, in particular to a preparation method of a UV (ultraviolet) viscosity-reducing adhesive tape, which comprises the following steps: taking 100g of polymer, adding 10-80g of ethyl acetate, an isocyanate curing agent and a photoinitiator, then uniformly stirring, standing and defoaming to obtain an adhesive, uniformly coating a PET (polyethylene terephthalate) release film with the standing adhesive, putting into a drying oven to bake and dry, then attaching to a PO (polyolefin) base film, and drying to obtain the UV viscosity-reducing adhesive tape. And putting the adhesive tape process product into an aging room, and placing the adhesive tape process product at normal temperature for 7 days to obtain the UV viscosity-reducing adhesive tape of the PO base material. The UV viscosity-reducing adhesive tape disclosed by the invention can realize the performance that a common UV viscosity-reducing adhesive tape cannot be balanced in a severe environment, has the general characteristics of high adhesive force at an initial stage and extremely low adhesive force after UV treatment in the aspect of performance, can resist strong acid corrosion before UV treatment, can be applied to acid etching protection of glass, can be subjected to viscosity-reducing stripping through UV irradiation after an etching process is completed, and is low in adhesive force and high in adhesive force. And automatic operation is easy, and no adhesive residue risk exists.

The invention belongs to the technical field of PI glue patterns, and particularly relates to a method for changing the appearance of a PI glue side wall. The surface of a wafer is coated with PI glue, the obtained wafer coated with the PI glue is baked, then the wafer with a PI glue layer is subjected to first exposure with a mask and second exposure without the mask, and the dosage of the second exposure accounts for less than or equal to 10% of the dosage of the first exposure; and finally, developing the wafer after the secondary exposure, and obtaining a PI glue pattern on the surface of the wafer. According to the method provided by the invention, smoother PI glue side wall morphology and inclination angles can be obtained, stress concentration of metal connecting wires is reduced, the problems of metal wire breakage and open circuit are reduced, and the yield and reliability of chips are improved; meanwhile, the equipment investment cost is low, and the exposure efficiency is high.

The invention discloses a data generation method of a photoetching pattern, an electron beam exposure system, a medium and a product, which are applied to the technical field of photoetching. The method is applied to an electron beam exposure system comprising an upper computer and a lower computer. The method comprises the following steps: receiving first original coordinate data and second original coordinate data of a layout transmitted by the upper computer; performing linear interpolation based on the first original coordinate data and the second original coordinate data to obtain a plurality of pieces of original intermediate coordinate data; respectively mapping the first original coordinate data, the second original coordinate data and each piece of original intermediate coordinate data into first mapping coordinate data, second mapping coordinate data and each piece of mapping intermediate coordinate data of a lower computer; and performing exposure operation based on the first mapping coordinate data, the second mapping coordinate data and the mapping intermediate coordinate data. The data transmission quantity between the upper computer and the lower computer can be reduced, the bandwidth occupation and delay of data transmission are reduced, and the exposure efficiency is improved while the exposure precision is guaranteed.

The present application provides a large-format sub-pixel micro-scanning printing method, including: determining the periodic unit size of the metamaterial used for the model to be printed, wherein the metamaterial has a plurality of periodically arranged pattern units, and the diameter and / or side length of each pattern unit is the periodic unit size; adjusting the optical imaging size according to the periodic unit size of the metamaterial; slicing the model to be printed to obtain two or more layers of slices, and calculating a plurality of scanning position coordinates on each layer of slices; and traversing the plurality of scanning position coordinates on each layer of slices and performing exposure and curing. The large-format sub-pixel micro-scanning printing method, printing device, and printing control system of the present application can realize high-precision and high-efficiency three-dimensional printing of metamaterials.

The embodiment of the invention provides Zn-based organic coordination nanoparticles and a preparation method thereof, a photoresist composition and application thereof, the Zn-based organic coordination nanoparticles are obtained by mixing and stirring a zinc-containing compound, a nitrogen-containing organic ligand and a compound A in an organic solvent and then performing post-treatment, and the compound A is benzoylformic acid and a derivative thereof. According to the Zn-based organic coordination nanoparticle photoresist provided by the embodiment of the invention, under the condition of no photoinitiator, benzoylformic acid in the photoresist structure absorbs photons for self-initiation, and an exposure pattern is directly obtained, so that the exposure efficiency is improved.

The utility model relates to a solar cell exposure streamline, and relates to the technical field of solar cell production, the solar cell exposure streamline comprises two exposure units, the two exposure units are connected end to end, and each exposure unit comprises two feeding and discharging streamlines; each feeding and discharging streamline comprises a feeding machine, a feeding and discharging gantry module and a discharging machine which are sequentially connected, and an exposure machine is arranged between the two feeding and discharging streamlines. The solar cell exposure flow line has the advantages that the two feeding and discharging flow lines and the two exposure units are arranged, so that the solar cell conveying efficiency of the solar cell exposure flow line is improved, the exposure machine exposes the two feeding and discharging flow lines in turn, and the exposure efficiency of large-scale production can be improved.

The present invention discloses a fully automatic double-sided exposure machine, which includes a loading device, an unloading device, a first table, a second table, at least one transfer and handling component and a flipping and handling component, an exposure system located between the first table and the second table, the first table and the second table are respectively moved to the exposure system on both sides of the exposure system for exposure operation, and the transfer and handling component and the flipping and handling component are fixedly installed by a bracket. The present invention adopts a double table, shares an exposure system, cooperates with the flipping and handling component and the transfer and handling component, and performs alignment exposure on the double tables respectively. The two tables can respectively perform alignment exposure on the two exposure surfaces of the base member without interfering with each other, and the exposure efficiency is high.

The invention discloses a process for improving the exposure efficiency of a circuit board, and relates to the related field of circuit board technologies, and the process structurally comprises a base, a box body fixedly connected to the upper end face of the base, a movable door arranged at the front end of the box body, and discharge ports formed in the left end face and the right end face of the box body. When exposure is completed, a small motor is started to drive a placement plate to move, meanwhile, a clamping block is clamped into the inner side of a clamping opening to fix a first connecting column, and when the placement plate continues to move, due to the fact that the placement plate is blocked by a support plate, the placement plate is relatively supported by the support plate; and meanwhile, compared with a first connecting column, rotation is conducted, a second bevel gear is driven by a first bevel gear to oppositely drive a clamping plate to be opened, limiting on the circuit board is disengaged, and the circuit board falls into the inner side of a discharging opening to be collected.

The embodiment of the invention provides a flexible circuit board production exposure method and device and a storage medium. Controlling the coiled circuit board to enter the fixing module from an inlet of the flexible circuit board production exposure equipment; controlling a fixing module to identify the positioning points of the coiled circuit board, and sequentially fixing the plurality of flexible circuit boards on the coiled circuit board in the exposure area according to the positioning points; controlling an exposure module to expose the flexible circuit board to obtain an exposed circuit board; and outputting the exposure circuit board. The coiled circuit board is placed in the fixing module to fix the multiple flexible circuit boards in sequence, so that the multiple flexible circuit boards on the coiled circuit board are exposed in sequence through the exposure module, the multiple flexible circuit boards on the coiled circuit board can be exposed in sequence, the exposure efficiency of the flexible circuit boards is effectively improved, and the exposure efficiency of the flexible circuit boards is improved. The flexible circuit board can be widely applied to the technical field of exposure equipment.

The utility model provides silicon wafer processing equipment which comprises a silicon wafer conveying device which comprises a conveying driving module and a bearing mechanism, the conveying driving module is connected with the bearing mechanism to drive the bearing mechanism to move, and a silicon wafer receiving position, a screen printing position and an exposure position are sequentially arranged along the movement track of the bearing mechanism; the silicon wafer screen printing device is used for finishing screen printing operation on the silicon wafer to be processed on the bearing mechanism at the screen printing position; the silicon wafer exposure device is used for completing exposure operation on the silicon wafer to be processed on the bearing mechanism at the exposure position, through the setting mode, both silk-screen operation and exposure operation can be directly completed on the bearing mechanism, the silicon wafer does not need to be transferred to other places, the transfer operation on the silicon wafer to be processed is reduced, and the production efficiency is improved. And the screen printing efficiency and the exposure efficiency are improved.

The invention discloses a two-in-two-out double-station exposure machine, comprising a frame, a loading and unloading manipulator, an assembly line mechanism, a double-carrier platform, a three-axis compensation module, a carrier body, a shading plate CCD positioning module, a shading plate lifting module, an exposure light source module and an incoming material CCD positioning module. The four ends of the bottom surface of the frame are fixedly connected with tripods. The beneficial effects of the invention are as follows: after the parallel light source passes through the shading plate, the shading plate will cover the places that do not need to be exposed, and the light of the places not covered will shine on the products, and the energy of the light will be used to expose the products. By setting up the double-carrier platform, multiple products can be exposed at the same time, and the production efficiency is greatly improved. At the same time, Teflon roller conveying is used to better ensure the cleanliness inside the machine and protect the products. A set of CCD is equipped with an adjustment platform and a scale to facilitate camera adjustment. The flatness between the light source, the carrier and the shading plate can be freely adjusted, and the exposure efficiency is improved.

The embodiment of the application provides a communication package recommendation method, system, device and storage medium, the method comprises: calculating the activity value based on the page access time length, the page access times and the recent access time; in the case where the activity value is greater than the first preset threshold, query whether there is a package change record in the historical package information; in the case where there is no package change record in the historical package information, respectively, the statistical feature of the historical call information and the historical traffic information is calculated to obtain the call feature value and the traffic feature value; in the case where the call feature value is greater than the first threshold, and the traffic feature value is greater than the second threshold, the exposure weight of the communication package corresponding to the comprehensive package type in the exposure weight list is increased; at least one target communication package in the adjusted exposure weight list whose exposure weight is greater than the preset weight threshold is exposed in the preset network page. The scheme can adapt to different needs of users for personalized exposure of communication packages.

The invention relates to a negative developing photoresist containing hydrophobic resin as well as a preparation method and application of the negative developing photoresist. When the photoresist composition containing the hydrophobic resin is used for forming a film, the hydrophobic resin can be automatically separated to the surface of the film to form a protective layer. A photoresist film formed by the photoresist composition has low surface energy, a high receding contact angle (for example, greater than or equal to 85 degrees), a low sliding angle (for example, less than 15 degrees) and an advancing contact angle not exceeding 100 degrees, and is beneficial to reduction of exposure defects and improvement of exposure efficiency.

The invention discloses a parallel electron beam imaging photoetching system based on a micro electrostatic lens array and a control method, and aims to solve the technical problems that the existing electron beam photoetching efficiency is low, the system is complicated, and flexible zooming cannot be realized. The system sequentially comprises a unified electron source, a micro electrostatic lens array, an electron zooming focusing unit, a diaphragm plate and a vacuum sample table along the movement direction of an electron beam, and further comprises a driving circuit, the uniform electron source provides large-area uniform electron beams, the micro electrostatic lens array realizes on-off control of the electron beams through focusing / deflecting electrodes of each unit, the electronic zoom focusing unit adjusts imaging magnification through voltage ratio of multi-stage electrostatic electrodes, the diaphragm plate blocks the electron beams in an off state, and the driving circuit synchronously controls on-off and zoom magnification of the array. According to the invention, scanning-free and one-frame parallel exposure is realized, the imaging scaling can be flexibly adjusted, and the device has the advantages of high integration level, good stability, high exposure efficiency and strong adaptability, and can be used for high-end nano manufacturing scenes such as mask preparation, quantum devices, advanced packaging and the like.

The embodiment of the invention provides Zn-based organic coordination nanoparticles, a preparation method thereof, a photoresist composition and application thereof, the Zn-based organic coordination nanoparticles have a general formula of Znx (M) y (N) z, x, y and z are integers greater than or equal to 1, and M is cinnamic acid and derivatives thereof; n is any one or more of organic fatty amines and derivatives thereof, pyridine and derivatives thereof, pyrrole and derivatives thereof, pyrimidine and derivatives thereof, pyridazine and derivatives thereof, piperidine and derivatives thereof, and amide and derivatives thereof. According to the Zn-based organic coordination nanoparticle photoresist provided by the embodiment of the invention, an exposure pattern can be directly obtained through self-initiation of cinnamic acid absorption photons in the photoresist structure in the absence of a photoinitiator, so that the exposure efficiency is improved.

The utility model belongs to the field of exposure machines, and particularly relates to a CCD (charge coupled device) dynamic compensation mechanism for wafer centering of a double-sided exposure machine, which comprises a bottom plate, a vertical plate is fixedly connected to the edge of the top of the bottom plate, a horizontal adjusting assembly is rotationally connected to one side of the vertical plate, a moving platform is fixedly connected to the surface of the horizontal adjusting assembly, and an angle adjusting assembly is fixedly connected to the top of the moving platform. Through the structural design of the horizontal adjusting assembly, after a customized voice coil motor A is electrified, a transmission rod A directly rotates in a permanent magnetic field through an electrified coil, intermediate transmission parts such as a gear and a screw rod are not needed, mechanical gaps and inertial delay are avoided, the transmission rod A drives a threaded rod to rotate while rotating, and a threaded cylinder is pushed to move by rotating a thread, so that the transmission rod A is driven to rotate. Therefore, the positions of the moving platform, the upper structure of the moving platform and the wafer are changed, so that the CCD dynamic compensation mechanism can quickly respond and adjust the position of the wafer, and the exposure efficiency of the wafer is improved.