Mask plate-based secondary exposure method for integrated circuit substrate

Abstract

The invention belongs to the technical field of semiconductors and discloses a mask plate-based secondary exposure method for an integrated circuit substrate. The method comprises the steps of S1, selecting a mask plate; S2, selecting two or three points on the mask plate to serve as measurement alignment mark points and performing marking; S3, performing primary exposure on the integrated circuit substrate; S4, performing alignment operation on the mask plate based on the selected two or three measurement alignment mark points; and S5, performing secondary exposure on the integrated circuit substrate. According to the method, the alignment operation is performed according to alignment based on obtained coordinate data after the integrated circuit substrate is subjected to the primary exposure, and then the integrated circuit substrate is subjected to the secondary exposure, so that the alignment operation time in the secondary exposure process is effectively shortened, the exposure efficiency is improved, and the production capacity is increased.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a secondary exposure method for an integrated circuit substrate. Background technique [0002] In the manufacturing process of semiconductors, integrated circuits, photovoltaic products and other electronic products, it is necessary to perform exposure treatment on various substrates represented by semiconductor wafers and photomasks. These substrates also include liquid crystal displays, glass substrates for plasma displays, magnetic disks, optical Disk motherboards, etc., are collectively referred to as masks below. A secondary exposure process is usually required for high-order masks (eg, advanced phase-shift mask lamps) or for necessary defect repairs. [0003] Before the second exposure process of the mask, since the images presented by the first exposure, development, etching and other processes already exist on the substrate, the position of the mask needs to be ca...

AI Technical Summary

Problems solved by technology

However, it will take about 10 to 15 minutes to perform alignment at each alignment mark, and it will take more than an hour to complete the alignment of the four points, while the exposure time of the basic board itself is about 2 hours. will take a lot of time

If there are more products that need to be exposed twice, the exposure efficiency of the laser exposure machine will be reduced, thereby affecting the overall output

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