Exposure method and exposure apparatus

An exposure method and equipment technology, which is applied in the direction of microlithography exposure equipment, photomechanical equipment, photoplate making process exposure equipment, etc., can solve the problems of underutilization of light, low exposure efficiency, energy waste, etc., and reduce exposure costs , Quantity reduction, and the effect of reducing energy consumption

Inactive Publication Date: 2013-07-17
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

In this way, each time a mask plate is used, only one substrate can be exposed, and the exposure of one substrate can only be completed in one production takt cycle; at the same time, only a small part of the exposure light provided by the light source is used, and most of the other Light is not fully utilized and lost
Therefore, the exposure method and exposure equipment in the prior art not only have low exposure efficiency, but also cause waste of energy

Method used

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  • Exposure method and exposure apparatus
  • Exposure method and exposure apparatus
  • Exposure method and exposure apparatus

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Embodiment Construction

[0035] The specific implementation manner of the present invention will be further described below in conjunction with the drawings and embodiments. The following examples are only used to illustrate the present invention, but not to limit the scope of the present invention.

[0036] The exposure equipment provided by the present invention is suitable for the preparation process of the substrate whose film layer can transmit light; it mainly includes a light source for providing parallel exposure light, a mask plate arranged in sequence along the propagation direction of the exposure light, and at least two substrates The bearing mechanism: the mask plate and the substrate bearing mechanism are both perpendicular to the propagation direction of the exposure light. Since in actual operation, the substrate is mostly arranged in the horizontal direction, so in this embodiment, the mask plate and the substrate supporting mechanism are all arranged in the horizontal plane, and the ...

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Abstract

The invention relates to the technical field of display, in particular to an exposure method and an exposure apparatus for implementing the exposure method. A plurality of substrates coated by photoresist are arranged under one mask, parallel exposure light is adopted to irradiate the masks vertically; the photoresist of the top substrate is exposed by the parallel exposure light, the parallel exposure light penetrates the top substrate to continuously expose the photoresist of the substrates under the top substrate, and so on, till the exposure processes of the photoresist of all the substrates are completed. Since the photoresist of a plurality of substrates can be exposed synchronously, exposure efficiency is effectively improved; and meanwhile, since the number of the used masks is greatly reduced, exposure cost is reduced considerably; and since the same exposure light is fully utilized, energy consumption is reduced, and exposure cost is further reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an exposure method and exposure equipment for realizing the exposure method. Background technique [0002] Liquid Crystal Display (LCD) has occupied a dominant position in the field of flat panel display due to its advantages of stable picture, vivid image, radiation elimination, space saving and energy saving. TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-Liquid Crystal Display) is the current mainstream liquid crystal display, and the thin film transistor array substrate (TFT-Thin Film Transistor) and color filter substrate are the main components of its display panel. The production efficiency of the array substrate and the color filter substrate is often related to the production tact of the entire display device. [0003] In the preparation process of array substrate and color filter substrate, photolithography process is very important; figur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/20G03F7/2014G03F7/707
Inventor 黄常刚吴洪江王耸万冀豫李圭铉
Owner BOE TECH GRP CO LTD
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