The utility model relates to the technical field of
chip application, in particular to a gold bump structure for a
chip with both pressing area and stability, which comprises a substrate, a bonding pad, a protective layer and a
metal layer. One side of the substrate is connected with a bonding pad, one side of the substrate is connected with a protective layer at equal intervals, and the protective layer is provided with an opening corresponding to the bonding pad; a
metal layer is arranged on one side, far away from the substrate, of the bonding pad; by utilizing photoetching
exposure (reducing
exposure capability and finely adjusting
exposure key points), development (prolonging development time or
secondary development) and
plasma technologies, the bottom of a
photoresist window after development is etched outwards and electroplated to form a foundation, so that a gold bump structure can compensate for drilling and
etching by using a bottom bump foundation, the aim of miniature bump size is fulfilled, and the cost is reduced. In addition, the bottom foundation of the bump is stable, the gold bump is stable in structure, the gold bump is not prone to toppling and deforming due to
chip vibration and shaking and rear-section
cutting and washing, and the
actual use requirement is met.