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Phototonus resin combination, solder resist combination for printed wiring board and printed wiring board

A photosensitive resin, printed wiring board technology, used in printed circuits, printed circuit manufacturing, optics, etc., can solve the problems of discoloration, decline in reflectivity, and decline in commodity value, and achieve less discoloration and reflectivity. The effect of exposure

Inactive Publication Date: 2010-03-24
TAMURA KAKEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of white solder resist, discoloration and a decrease in reflectance are particularly noticeable, so it may lead to a decrease in product value, which needs to be resolved

Method used

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  • Phototonus resin combination, solder resist combination for printed wiring board and printed wiring board
  • Phototonus resin combination, solder resist combination for printed wiring board and printed wiring board
  • Phototonus resin combination, solder resist combination for printed wiring board and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] Each component was mixed in the following mass ratio to prepare a solder resist composition. The detailed ingredient amounts are as follows.

[0089] (A) "CYCLOMER-P(ACA)Z-251" manufactured by Daicel Chemical Industry Co., Ltd. 40% by mass

[0090] (B) 0.05% by mass of trimethylolpropane trithiopropionate

[0091] (C) Acylphosphine-based photopolymerization initiator ("IRGACURE 819" manufactured by Ciba Specialty Chemicals Co., Ltd.) 0.3% by mass

[0092] (D) Diluent (DPHA) 5% by mass

[0093] (E) Rutile-type titanium oxide ("CR-80" manufactured by Ishihara Sangyo Co., Ltd. (Ishihara Sangyo Co., Ltd.)) 35% by mass

[0094] (F) Epoxy-based thermosetting compound ("EPICLON 860" manufactured by Dainippon Ink Chemical Industry Co., Ltd. (Dainippon Ink Chemical Industry Co., Ltd.)) 10% by mass

[0095] The rest is as follows:

[0096] Antifoaming agent, KS-66 (manufactured by Shin-Etsu Silicone Co., Ltd. (Shin-Etsu Silicone Co., Ltd.))

[0097] Thixotropic agent, AEROS...

Embodiment 2

[0106] Compositions with the following compositions were produced in the same manner as in Example 1. However, it is the same as in Example 1 except (A)-(F).

[0107] (A) "CYCLOMER-P(ACA)Z-251" manufactured by Daicel Chemical Industry Co., Ltd. 40% by mass

[0108] (B) 1% by mass of trimethylolpropane trithiopropionate

[0109] (C) Acylphosphine photopolymerization initiator ("IRGACURE 819" manufactured by Ciba Specialty Chemicals Co., Ltd.) 0.3% by mass

[0110] (D) Diluent (DPHA) 5% by mass

[0111] (E) Rutile-type titanium oxide ("CR-80" manufactured by Ishihara Sangyo Co., Ltd.) 35% by mass

[0112] (F) Epoxy thermosetting compound ("Epiclon 860" manufactured by Dainippon Ink Chemical Industry Co., Ltd.) 10% by mass

Embodiment 3

[0114] Compositions with the following compositions were produced in the same manner as in Example 1. However, it is the same as in Example 1 except (A)-(F).

[0115] (A) "CYCLOMER-P(ACA)Z-251" manufactured by Daicel Chemical Industry Co., Ltd. 40% by mass

[0116] (B) 5% by mass of trimethylolpropane trithiopropionate

[0117] (C) Acylphosphine photopolymerization initiator ("IRGACURE 819" manufactured by Ciba Specialty Chemicals Co., Ltd.) 0.3% by mass

[0118] (D) Diluent (DPHA) 5% by mass

[0119] (E) Rutile-type titanium oxide ("CR-80" manufactured by Ishihara Sangyo Co., Ltd.) 35% by mass

[0120] (F) Epoxy thermosetting compound ("Epiclon 860" manufactured by Dainippon Ink Chemical Industry Co., Ltd.) 10% by mass

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Abstract

The present invention provides a light-sensitive resin combination, a solder resist combination for a printed wiring board and a printed wiring board; the invention also provides a liquid resin combination having less descend of reflection index and color degradation of a white coated film caused by irradiation of UV in a hot process and capable of forming a pattern by a low exposure amount. The light-sensitive resin combination contains (A) active energy ray curing resin obtained by reaction of alicyclic ring cage epoxide having ethylene unsaturated bond with copolymerization resin, wherein the copolymerization resin is selected from monomer of acroleic acid and acrylic ester, and copolymer of monomer of methacrylic acid and metacrylic acid ester; (B) mercaptan series coumpound; (C) lightpolymerization initiator; (D) diluting agent; (E) red schorl type titanium oxide; and (F) epoxy series thermoset coumpound.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a solder resist composition for printed wiring boards, and a printed wiring board. Background technique [0002] A printed wiring board is a board that is used to form a pattern of a conductive circuit on a substrate and mount electronic components by soldering them on the pads of the pattern. Membrane coating. This prevents solder from adhering to unnecessary parts when soldering electronic components on a printed wiring board, and prevents circuit conductors from being corroded by oxidation or humidity due to direct exposure to air. [0003] Along with the increase (densification) of the wiring density of printed wiring boards, the solder resist composition is also required to have high resolution and high precision. Whether it is a consumer board or an industrial board, the position is proposed by the screen printing method. Liquid photo-solder resist method (photographic develop...

Claims

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Application Information

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IPC IPC(8): G03F7/028H05K1/00
CPCG03F7/028G03F7/0385H05K3/064
Inventor 大野隆生清田达也西山弘恭长谷川靖幸
Owner TAMURA KAKEN CO LTD
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