Double-side exposure machine and double-side exposure method

Abstract

The invention relates to a double-side exposure machine and a double-side exposure method, wherein the double-side exposure machine comprises a mounting frame, a first exposure assembly and a second exposure assembly arranged on two sides of the mounting frame respectively, a first loading platform and a second loading platform, and a driving mechanism. The driving mechanism comprises a driving assembly, and the first loading platform and the second loading platform pass through the exposure area in a first motion state and a second motion state respectively. When exposed, the first loading platform moves in a first circular track and passes through the exposure area in the first motion state to expose a first to-be-exposed part; and the second loading platform moves in a second circular track and passes through the exposure area in the second motion state to expose a second to-be-exposed part. The first loading platform and the second loading platform are in circular motion, and whenthe second to-be-exposed part is exposed, unloading of a first exposure finished product or loading of the next first to-be-exposed part can be carried out; the exposure efficiency is higher, and theexposure precision is higher compared with a traditional mode adopting overturning double-side exposure.

Description

technical field [0001] The invention relates to the technical field of double-side exposure, in particular to a double-side exposure machine and a double-side exposure method. Background technique [0002] Traditional double-sided exposure machines usually use film transfer printing to expose double-sided circuit boards. Before exposure, it is necessary to make the film with the pattern to be transferred; then, fix the film with the pattern on both sides on the upper and lower glass respectively; then, sandwich the circuit board with the pattern to be transferred between the upper and lower glass, use The blue-violet high-brightness light source is used for exposure, and the circuit pattern is transferred to the circuit board to complete the double-sided exposure. For laser direct writing exposure machines, single-side exposure is usually used. Firstly expose one side of the circuit board, turn it over after the exposure is completed, then expose the other side of the circ...

AI Technical Summary

Problems solved by technology

[0003] However, when the laser direct writing exposure machine performs double-sided exposure, it needs to perform flipping operation, and the flipping operation will inevitably cause the problem of alignment after flipping, which not only increases the exposure process, but also affects the exposure accuracy due to the alignment accuracy problem. thus affecting the final exposure effect

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