Double-sided exposure machine and double-sided exposure method

A double-sided exposure and to-be-exposed technology, which is used in optomechanical equipment, microlithography exposure equipment, photolithography exposure devices, etc., can solve problems such as alignment accuracy affecting exposure accuracy, affecting exposure effects, and increasing exposure processes.

Active Publication Date: 2018-11-23
ZHONGSHAN AISCENT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the laser direct writing exposure machine performs double-sided exposure, it needs to perform flipping operation, and the flipping operation will inevitably cause the problem

Method used

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  • Double-sided exposure machine and double-sided exposure method
  • Double-sided exposure machine and double-sided exposure method
  • Double-sided exposure machine and double-sided exposure method

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Embodiment Construction

[0030] Embodiments of the present invention are described in detail below in conjunction with accompanying drawings:

[0031] It should be noted that when an element is “fixed” to another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the descrip...

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PUM

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Abstract

The invention relates to a double-sided exposure machine and a double-sided exposure method. The double-sided exposure machine comprises a worktable; the exposure machine comprises a first exposure component and a second exposure component each capable of movingalong the worktable, and forms an exposure area on the worktable; the loading machine comprises a loading platform; a first loading part and a second loading part are disposed on the loading platform, and the first loading part and the second loading part are disposed at a pitch; the loading platform is movable along the worktable and moves the first loading part or the second loading part to the exposure area. According to the arrangement of the movable first exposure component and second exposure component, the loading platform ismoved to the preset position during exposure, so that the first loading part or the second loading part is located in the exposure area, and then the first exposure component and the second exposurecomponent move toexpose the corresponding first component to be exposed or the second component to be exposed. Due to the simultaneous double-sided exposure, operations such as flippingare avoided, the exposure process and alignment are reduced, and the exposure efficiency and the exposure precision are improved.

Description

technical field [0001] The invention relates to the technical field of double-side exposure, in particular to a double-side exposure machine and a double-side exposure method. Background technique [0002] Traditional double-sided exposure machines usually use film transfer printing to expose double-sided circuit boards. Before exposure, it is necessary to make the film with the pattern to be transferred; then, fix the film with the pattern on both sides on the upper and lower glass respectively; then, sandwich the circuit board with the pattern to be transferred between the upper and lower glass, use The blue-violet high-brightness light source is used for exposure, and the circuit pattern is transferred to the circuit board to complete the double-sided exposure. For laser direct writing exposure machines, single-side exposure is usually used. Firstly expose one side of the circuit board, turn it over after the exposure is completed, then expose the other side of the circ...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/70716G03F7/70725G03F7/70758G03F7/70775
Inventor 汪孝军廖平强张胜
Owner ZHONGSHAN AISCENT TECH
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