Insulating device and method for refrigerating and heating of semiconductors

Abstract

The invention discloses an insulating device and method for refrigerating and heating of semiconductors. The device comprises a cold and heat dissipation module, a semiconductor refrigerating and heating module and an insulating device for refrigerating and heating of the semiconductors. The method mainly comprises the steps of testing the temperature of a metal heat sink, the environment temperature of air, the temperature of a heat dissipation table and the temperature of an insulating and refrigerating box in a working insulating mode, and carrying out making operation or insulating power-saving working mode by analysis; and when in the insulating mode, finishing heat isolation of the cold and heat dissipation module from the semiconductor refrigerating and heating module by the insulating device for refrigerating and heating of the semiconductors. The insulating device for refrigerating and heating of the semiconductors is added between the semiconductor refrigerating and heating module and the cold and heat dissipation module, when the insulating device for refrigerating and heating of the semiconductors is standby, direct energy transmission between the cold and heat dissipation module and the semiconductor refrigerating and heating module is isolated, an indirect insulating mode is utilized effectively, an insulating purpose is achieved, and the birth defects of the original semiconductor refrigerating and heating device are overcome effectively.

Description

technical field [0001] The invention relates to the refrigeration and heating industry, in particular to a thermal insulation device and method for semiconductor refrigeration and heating. Background technique [0002] At present, the existing semiconductor refrigeration technology is a direct combination of the semiconductor refrigeration and heating module and the cooling and heating module. When in standby, the energy on the cooling and heating module is directly returned to the semiconductor refrigeration and heating module, and the heat preservation effect is not very good. it is good. Contents of the invention [0003] The purpose of the present invention is to address the deficiencies of the prior art, to provide a semiconductor refrigeration and heating heat preservation device and method, in which a semiconductor refrigeration and heating heat preservation device is added between the semiconductor refrigeration and heating module and the cooling and heat module, ...

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Problems solved by technology

[0002] At present, the existing semiconductor refrigeration technology is a direct combination of the semiconductor refrigeration and heating module and the cooling and heating module. When in standby, the energy on the cooling and heating module is directly returned to the semiconductor refrigeration and heating module, and the heat preservation effect is not very good. it is good

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