Thimble anti-collision structure and thimble module

Abstract

The invention relates to a thimble anti-collision structure and a thimble module. The thimble anti-collision structure comprises a conductor barrel capable of inserting the thimble and a conductive ring sleeved on the periphery of the conductor barrel, the outer periphery of the electric conductor is provided with an elastic supporting member, one end of the elastic support is connected with the electric conductor, the other end of the elastic support is connected with the conductive ring, when working normally, the conductor is spaced apart from the conductive ring, the power is off between the two, when an external object strikes, the conductive ring moves relative to the torch, the conductive ring is in contact with the torch and energized, and the controller controls the workbench to stop emergency or control the thimble module to move downward according to the signal of the conductive ring and the torch contacting and energized, so as to avoid the thimble module from being crashed.

Description

Technical field [0001] The invention relates to the field of semiconductor post packaging, in particular to a thimble anti-collision structure and a thimble module. Background technique [0002] In the semiconductor manufacturing process, the crystal grains formed through processes such as deposition, sputtering, and etching also need to be packaged subsequently to protect the internal structure and prevent external impurities from entering and affecting performance. In the process of post-semiconductor packaging, it is necessary to realize the crystal taking process through the thimble module. Specifically, after the blue film of the wafer is expanded, the ejector pin of the ejector module lifts the wafer upward, and the corresponding suction nozzle adsorbs the wafer to complete the crystal removal process. In the process of taking the crystal, the ejector module only moves in the vertical direction to complete the process of lifting the wafer. The worktable moves on the horiz...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a thimble anti-collision structure and a thimble module for the problem that the thimble module is easy to be hit during the crystal extraction process and cause damage.

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