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Heat dissipation device

A heat dissipation device and thermal energy technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment construction parts, etc., can solve the problem of affecting the use efficiency of functional electrical components, the inability to simplify and intuitive operation methods, and the dependence of mobile terminal systems Large and other problems, to achieve the effect of saving indoor layout space, effective heat dissipation, and effective discharge

Inactive Publication Date: 2018-12-18
HANGZHOUSNGOOSE ELECTRICAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Home digital systems are being researched and promoted more and more widely. Most of them are operated together by intelligent digital devices together with software or computer programs. For example, in order to realize centralized control of home products, users usually choose to use mobile terminals ( For example, mobile phones or personal computers, etc.) to control, but this method is limited by the functionality of the mobile terminal itself, and the complicated installation of firmware cannot make the user's operation mode simplified and intuitive, and at the same time, it is aimed at the functions of each household product. The control instruction set is highly dependent on the mobile terminal system, which greatly restricts the update method of household products
[0004] In addition, the compact structure realized in order to solve such defects often has the problem of poor heat dissipation, which will greatly affect the use efficiency of various functional electrical components inside the structure

Method used

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Examples

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Embodiment Construction

[0036] Reference in this specification to "one embodiment" or "example" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

[0037] In addition, in the accompanying specification and claims of the present invention, the terms "coupled" and "coupled" and their derivatives may be used. Those of skill should understand that these terms are not intended as synonyms for each other. "Coupled" is used to indicate that two or more elements, which may or may not be in direct physical or electrical contact with each other, co-operate or interact with each other. "Connected" is used to mean the establishment of communication between two or more elements coupled to each other.

[0038] The processing steps shown in the ...

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Abstract

A heat dissipation device comprises a plurality of stacked mounting bodies and a base for carrying and mounting such bodies in a building surface, the base having an input end and an output end respectively connecting an external transmission network of a home and an internal transmission network of the home, wherein the body comprises a first body fixedly mounted on the base. A guide plate with aplurality of flow guiding members is arranged in the bottom cavity of the first body, wherein gas is extracted from the bottom cavity on the guide plate into the first body cavity and diffused towardthe top of the accommodation cavity. The first body is provided with a plurality of data signal control plates including a power signal control plate, and the data signal control plates are insertedinto corresponding slots arranged in the first body in parallel. The top cover plate and the bottom plate of the data signal control plate are provided with through holes corresponding to each other so as to penetrate the pumped gas through the through holes and carry the thermal energy of the data signal control plate.

Description

[0001] This invention is a divisional application of the Chinese patent No. 201610488716.X, titled "A Heat Dissipating Device" filed by my applicant on June 27, 2016. At least part of the content of this patent specification is incorporated by reference This article. technical field [0002] The invention mainly relates to a smart home system, in particular to a heat dissipation device for a home digital switching device. Background technique [0003] Home digital systems are being researched and promoted more and more widely. Most of them are operated together by intelligent digital devices together with software or computer programs. For example, in order to realize centralized control of home products, users usually choose to use mobile terminals ( For example, mobile phones or personal computers, etc.) to control, but this method is limited by the functionality of the mobile terminal itself, and the complicated installation of firmware cannot make the user's operation mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 章昭徐鹤还王晓东
Owner HANGZHOUSNGOOSE ELECTRICAL
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