Adhesive having high glass-transition temperature and flexible copper-coated plate

A flexible copper clad laminate, transition temperature technology, used in adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problem of heat resistance, chemical resistance, dimensional stability, long-term reliability can not meet the requirements of use, Problems such as limited heat resistance and low glass transition temperature, to achieve the effect of low cost, strong peeling performance, and excellent heat resistance
CN109096979AInactive Publication Date: 2018-12-28南昌正业科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
南昌正业科技有限公司
Publication Date
2018-12-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides an adhesive having high glass-transition temperature. The adhesive has very high glass-transition temperature (Tg) 170 DEG C, and the heat-resistant performance is superior to those of epoxy system adhesive and acrylic ester system adhesive. A flexible copper-coated plate prepared by using the adhesive has the excellent heat-resistant performance, bonding performance, flameresistance performance and weather-proof performance and can be applied to the field of high-end circuit boards, such as automobiles, G-series high-speed trains, spaceflight and war industry.
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Description

technical field

[0001] The invention belongs to the technical field of adhesives, and in particular relates to an adhesive with a high glass transition temperature and a flexible copper-clad board. Background technique

[0002] Flexible copper clad laminate (FCCL) is mainly a kind of copper clad laminate with good flexibility made of high temperature resistant polyimide (PI) as the insulating base film, because it is light, thin, small in size and flexible It is widely used in mobile phones, digital cameras, digital video cameras, notebook computers, flat-panel TVs, office automation equipment, automotive electronics, instrumentation, medical machinery, aerospace, military and other fields.

[0003] In flexible copper clad laminates, the adhesive used to bond PI film and copper foil is a key factor determining the performance of copper clad laminates. At present, the adhesives used for flexible copper clad laminates are mostly epoxy resin adhesives and acrylate adhesives. ...

Claims

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