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Device for measuring temperature of electromagnetic heating device and electromagnetic heating device

A heating equipment and electromagnetic technology, applied in the direction of using electric devices, measuring devices, using electromagnetic means, etc., can solve the problems of pots not being universal, inconvenient to use, and poor thermal conductivity of glass-ceramic panels

Inactive Publication Date: 2018-12-28
MIDEA GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this measurement method is that: since there is a glass-ceramic panel between the temperature sensor and the pot, and the thermal conductivity of the glass-ceramic panel is poor, there is often a gap between the measured temperature and the actual temperature of the pot. Large deviation (up to dozens or even hundreds of degrees Celsius)
This measurement method has the following disadvantages: high cost; it is not universal for different pots; the temperature measurement error of pots of different materials is large
(2) Direct temperature measurement technology. This method is to directly install the temperature measurement device on the cooker. The temperature measurement device communicates with the main control circuit of the induction cooker through the communication module. This measurement method has the following disadvantages: high cost (the wireless mode needs to include Wireless communication module, inconvenient to use in wired mode); not universal (induction cooker and pot must correspond one by one)

Method used

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  • Device for measuring temperature of electromagnetic heating device and electromagnetic heating device
  • Device for measuring temperature of electromagnetic heating device and electromagnetic heating device
  • Device for measuring temperature of electromagnetic heating device and electromagnetic heating device

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Embodiment Construction

[0039] The specific implementation manners of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation manners described here are only used to illustrate and explain the embodiments of the present invention, and are not intended to limit the embodiments of the present invention.

[0040] figure 1 It is a schematic diagram of a device for temperature measurement of electromagnetic heating equipment provided by an embodiment of the present invention.

[0041] like figure 1 As shown, the embodiment of the present invention provides a device for temperature measurement of an electromagnetic heating device, the electromagnetic heating device includes a panel 102 and a coil disk (not shown), the device includes: at least one microhole located in the panel 102; and a temperature sensor 103 located in at least one microwell. The pot 101 is located above the pane...

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Abstract

The embodiment of the invention provides a device for measuring temperature of an electromagnetic heating device and an electromagnetic heating device, belonging to the field of household appliances.The device comprises: at least one microhole located in the panel; and a temperature sensor located in the at least one microhole. The device and electromagnetic heating device can solve the problemsof large temperature measurement error, slow response speed, low cost and versatility, and can be applied to various types of electromagnetic heating devices.

Description

technical field [0001] The invention relates to the field of household appliances, in particular to a device for temperature measurement of electromagnetic heating equipment and electromagnetic heating equipment. Background technique [0002] Measuring the temperature of the cooker is an important first step in the fire control and product protection of electromagnetic heating equipment (such as induction cooker). At present, the sensors for measuring the temperature of pots and pans for induction cookers on the market mainly adopt the "built-in type", that is, the temperature sensor is installed under the back of the glass-ceramic panel of the induction cooker and in the center of the coil disk. The disadvantage of this measurement method is that: since there is a glass-ceramic panel between the temperature sensor and the pot, and the thermal conductivity of the glass-ceramic panel is poor, there is often a gap between the measured temperature and the actual temperature of ...

Claims

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Application Information

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IPC IPC(8): H05B6/02G01K7/02G01K7/22
CPCH05B6/02G01K7/02G01K7/22
Inventor 黄新建伍叔云高安平熊贵林严平
Owner MIDEA GRP CO LTD
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