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A loading and unloading device for integrated circuit material surface treatment equipment

A surface treatment, integrated circuit technology, applied in the field of loading and unloading devices, can solve the problems of low production efficiency, low automation level and high labor cost

Active Publication Date: 2020-04-17
东莞奥美特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of surface treatment of integrated circuit materials, it is generally necessary to manually take out the workpiece placed in the material box, and transport it to the surface treatment equipment of integrated circuit materials for surface treatment, and then transport it to the original loading point after surface treatment. The processed workpiece is put back into the raw material box, so the existing surface treatment process has a low level of automation, low production efficiency and high labor costs

Method used

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  • A loading and unloading device for integrated circuit material surface treatment equipment
  • A loading and unloading device for integrated circuit material surface treatment equipment
  • A loading and unloading device for integrated circuit material surface treatment equipment

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Embodiment Construction

[0057] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings. In the description of this patent, it is to be understood that the terms "above", "below", "front", "rear", "left", "right", "vertical", "horizontal", "top ", "bottom", "inner", "outer" and other indicated orientations or positional relationships The orientations or positional relationships shown in the drawings are only for the convenience of describing this patent and simplifying the description.

[0058] Figure 1 to Figure 13 A preferred embodiment of the loading and unloading device for integrated circuit material surface treatment equipment of the present invention is shown.

[0059] The loading and unloading device for integrated circuit material surface treatment equipment of the present invention can be used for...

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Abstract

The invention relates to a feeding and discharging device for integrated circuit material surface treatment equipment. The feeding and discharging device comprises a support, a first feeding device, afirst lifting device, a material pushing device and a feeding conveying device. The support is provided with a material placing port. The first feeding device is arranged on the support and corresponds to the material placing port, and accordingly, a material box placed in from the material placing port and provided with workpieces is conveyed. The first lifting device is arranged on the supportand located at one end of the first feeding device so as to bear and drive the material box conveyed through the first feeding device to ascend and descend. The material pushing device is arranged atthe rear end of the first lifting device and corresponds to the first lifting device, and accordingly the workpieces in the material box are pushed to the feeding conveying device. The feeding conveying device is arranged at the front end of the first lifting device and corresponds to the material pushing device, and accordingly the workpieces pushed out by the material pushing device are conveyed. By means of the feeding and discharging device for the integrated circuit material surface treatment equipment, the conveying efficiency in the integrated circuit material surface treatment processcan be improved, and the automatic level of the feeding and discharging device is improved.

Description

technical field [0001] The invention relates to the technical field of surface treatment of integrated circuit materials, and more specifically relates to a loading and unloading device for surface treatment equipment of integrated circuit materials. Background technique [0002] In the process of surface treatment of integrated circuit materials, it is generally necessary to manually take out the workpiece placed in the material box, and transport it to the surface treatment equipment of integrated circuit materials for surface treatment, and then transport it to the original loading point after surface treatment. The processed workpieces are put back into the raw material box, so the automation level of the existing surface treatment process is low, the production efficiency is low and the labor cost is high. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an improved loading and unloading device for integrated...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/90
CPCB65G47/901
Inventor 苏骞刘全胜柳兴森彭仕镇
Owner 东莞奥美特科技有限公司