Quantitative glue injection device for high-temperature resin transfer molding

Abstract

The invention relates to the technical field of glue injection, in particular to a quantitative glue injection device for high-temperature resin transfer molding. The device comprises a tank, a tank cover and an air pump, the tank cover is mounted at the top of the tank, a second sealing ring is mounted at the bottom of the tank cover, a piston rod of the air pump penetrates the center of the tankcover and hermetically connected with the tank cover, a vertical rod is fixedly mounted at the bottom of the piston rod of the air pump, a pressing disk is connected at the bottom of the vertical rod, a first sealing ring is arranged on the out edge of the pressing disk, a plurality of first through holes are formed in the pressing disk, a driving component is arranged on one bottom side of the vertical rod, a guide component is arranged in the middle of the piston rod, a vacuum component is arranged on one top side of the tank, and a heating component is arranged on the outer side of the tank. The device has the functions of heating and quantitatively injecting glue, glue in the tank is heated by the heating component, the temperature of the glue is kept by the heating component, air inthe glue can be effectively discharged when the temperature is kept, extrusion of the glue cannot be affected by the air, extrusion amount of the glue is controlled by the air pump, and quantitative output of the glue is ensured.

Description

technical field [0001] The invention relates to the technical field of glue injection, in particular to a quantitative glue injection device for high-temperature resin transfer molding. Background technique [0002] Resin Transfer Molding (RTM) is a molding technique for composite materials. This process has the characteristics of high raw material utilization rate, low production cost, local reinforcement of parts, good finish, high dimensional accuracy, and simple process. It is currently the composite material forming process with the best comprehensive indicators. Although the cost of the RTM process is low, the technical requirements are high. The traditional RTM molding device is suitable for medium-batch, low-temperature (40-60°C) glue injection and production of medium and large components. This traditional RTM device is not suitable for high temperature (above 150°C) glue injection and the application of small components in the RTM process. For example, the visco...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the disadvantages of resin transfer molding technology in the prior art that it is difficult to apply to high-temperature environments, and propose a quantitative injection device for high-temperature resin transfer molding

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