Chemical nickel plating solution and chemical nickel plating method suitable for high-volume fraction SiCp/Al composite material

Abstract

The invention relates to a chemical nickel plating solution and a chemical nickel plating method suitable for a high-volume fraction SiCp/Al composite material. The chemical nickel plating solution comprises the following components of, in percentage by weight, 25-35 g/L of main salt; 20-30 g/L of a reducing agent; 20-30 g/L of a complexing agent; 5-10 g/L of an accelerator; 0.1-0.5 mg/L of a surfactant; and 1-5 mL/L of a composite stabilizer; the composite stabilizer is a combination of any two or more kinds of potassium iodate, potassium nitrate, trans-butenedioic acid or thiourea. Accordingto the chemical nickel plating solution and the chemical nickel plating method, the composite stabilizer is innovatively added in the chemical nickel plating solution, all the components in the composite stabilizer acts synergistically, the stability of the chemical nickel plating solution of the high-volume fraction SiCp/Al composite material is remarkably improved, the deposition rate and the compactness of the coating are not influenced, and the stability of the chemical nickel plating solution is improved to 5 cycles (MTO); and meanwhile, the technological process and technological parameters of chemical nickel plating are optimally designed, so that the prepared high-volume fraction SiCp/Al composite material nickel-plated layer has more excellent performance.

Description

technical field [0001] The invention relates to an electroless nickel plating solution and an electroless nickel plating method suitable for high volume fraction SiCp / Al composite materials, and is mainly used for high volume fraction SiCp / Al composites of high-volume microwave products of spacecraft, phased array antennas, aerospace power supplies, etc. The invention relates to the preparation of a material heat sink bottom plate and an electroless nickel plating layer of a casing, and improves the welding performance of a matrix material, belonging to the technical field of composite materials. Background technique [0002] High volume SiCp / Al composite material has the advantages of low density, high thermal conductivity and adjustable thermal expansion coefficient. It is the third generation of electronic packaging materials. The heat sink carrier and housing of the power supply have broad application prospects. [0003] Phased array antennas, microwave products and oth...

AI Technical Summary

Problems solved by technology

The two methods prepare the electroless nickel plating layer. Due to the high chemical activity of the substrate surface, the self-catalytic reaction rate of the electroless nickel plating solution is relatively fast, and the solution has a serious risk of self-decomposition, which seriously affects the quality of the coating and increases the production cost.

[0005] The main method to improve the stability of SiCp / Al composite electroless nickel plating solution is to add stabilizers, such as heavy metal ions, sulfur compounds, etc., but the effect of conventional single stabilizers on improving the stability of the solution is not obvious, and the service life of the solution is limited, especially It is a heavy metal ion, which does not meet the requirements of green production

Images