Unlock instant, AI-driven research and patent intelligence for your innovation.

A digital microfluidic chip fault repair method based on the combination of improved dijkstra algorithm and ipso

A technology of fault repair and digital microflow, which is applied in the direction of electrical digital data processing, calculation, computer-aided design, etc., can solve the problems of long time consumption and low efficiency, and achieve the effect of short repair time and high repair efficiency

Active Publication Date: 2022-04-29
HARBIN INST OF TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of long time and low efficiency of the existing digital microfluidic chip fault repair method, thereby providing a digital microfluidic chip fault repair method based on the combination of improved Dijkstra algorithm and IPSO

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A digital microfluidic chip fault repair method based on the combination of improved dijkstra algorithm and ipso
  • A digital microfluidic chip fault repair method based on the combination of improved dijkstra algorithm and ipso
  • A digital microfluidic chip fault repair method based on the combination of improved dijkstra algorithm and ipso

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0065] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0066] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0067] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0068] The principles involved in the present invention are as follows:

[0069] 1. Digital microfluidic chip d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The digital microfluidic chip fault repair method based on the combination of improved Dijkstra algorithm and IPSO relates to the field of digital microfluidic chip fault repair, in order to solve the problems of long time and low efficiency of the existing digital microfluidic chip fault repair methods. The method includes: step 1, calculating the shortest path between two droplets to be mixed based on the improved Dijkstra algorithm; the improved Dijkstra algorithm is to introduce a cost function into the existing Dijkstra algorithm, and the cost function guides the existing Dijkstra algorithm to the shortest distance to the starting point 1. Search in the direction with the shortest distance to the end point and the longest distance to the fault point; step 2, calculate the moving path based on IPSO, realize the shortest moving distance of the droplet under the condition of ensuring the completion of mixing, and complete the fault repair. The invention is suitable for repairing the failure of the digital microfluidic chip.

Description

technical field [0001] The invention relates to the field of digital microfluidic chip fault repair. Background technique [0002] With the development of science and technology, the field of automatic testing has expanded from the testing of analog circuits or digital circuits to the testing of MEMS (Micro-Electromechanical Systems). Microfluidic chip, also known as Lab-on-a-chip, can complete various functions of biological laboratory and routine chemical testing on a chip of a few square centimeters. It has the characteristics of miniaturization, high sensitivity, low cost, and integration. The first generation of microfluidic biochips has permanently etched microvalves, micropumps, and microchannels, and the specific operations are based on continuous fluid flow. The development of microfluidic technology and manufacturing process has promoted the generation of digital microfluidic chips, which manipulate discrete droplets on two-dimensional microfluidic arrays and hav...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/367G06F30/392G06F111/06
CPCG06F2111/06G06F30/392G06F30/367
Inventor 郑文斌付平石金龙尹洪涛王安琪叶俊涛孙媛媛
Owner HARBIN INST OF TECH