A loading device applied to a bullet loading machine

Abstract

The invention provides a loading device applied to a bullet loading machine and relates to the field of integrated circuits, including a rack, a material bomb tray, longitudinal rail, transverse sliding rail, a support mechanism with an elastic tube, a cartridge clips, a lifting and lowering mechanisms, a clip drive mechanism are arranged on that rack, the horizontal axis slide rail is arranged onthe longitudinal axis slide rail, the supporting mechanism and the lifting mechanism are arranged on the transverse shaft slide rail. The magazine driving mechanism is arranged on the lifting mechanism, and the magazine comprises an upper end cover, a plurality of elastic containers, a lower end cover and a drop plate which are connected in turn; the lower end cover is connected with the drop plate through a driving shaft; the elastic containers are distributed around the center of the lower end cover at an equal angle; and the lower end cover is provided with an elastic tube hole communicated with the elastic containers. The loading device is applied to the loading machine of the bomb, realizes the intelligent automatic operation, replaces the slow operation mode of manual placement, andhas high working efficiency. And it is not easy to leak out in the placing process, which greatly improves the production stability and effectively reduces the production environment pollution.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a filling device applied to a bomb filling machine. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , into microstructures with desired circuit functions. [0003] At present, in the middle and low-end integrated circuit packaging lines, cylindrical granular packaging materials (bullets) are mostly placed on the bracket manually. (1) The efficiency of manual operation is low and the labor cost is high; (2) During the placement process It is easy to leak in the middle and affect the product quality; (3) During the placement of the material bomb, there is a lot ...

AI Technical Summary

Problems solved by technology

[0003] At present, in the middle and low-end integrated circuit packaging lines, cylindrical granular packaging materials (bullets) are mostly placed on the bracket manually. (1) The efficiency of manual operation is low and the labor cost is high; (2) During the placement process (3) During the placement of the material bomb, the dust scattered by the material bomb is more, which has a certain impact on the health of workers and the production environment of the workshop

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