Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Continuous die for mainboard support of notebook computer

A notebook computer, motherboard bracket technology, applied in the direction of metal processing equipment, forming tools, manufacturing tools, etc., can solve problems such as complex bracket structure

Pending Publication Date: 2019-01-18
江苏杰邦电子科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Laptop motherboard brackets need to be equipped with installation and connection parts, and there are sound installation holes and multiple USB installation holes. The bracket structure is complex and requires continuous molds for production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Continuous die for mainboard support of notebook computer
  • Continuous die for mainboard support of notebook computer
  • Continuous die for mainboard support of notebook computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0030] see Figure 1 to Figure 4 , a notebook computer mainboard support continuous die described in a preferred embodiment of the present invention is characterized in that: it includes a workbench 1, and the punches for punching the workpiece 5 are sequentially arranged on the workbench 1 Hole die 2, punching die 3 for stamping and indenting the workpiece 5, bending die 4 for stamping and forming the workpiece 5, and transmission device 6 for transporting the workpiece 5 to move;

[0031] Wherein said punching die 2 comprises a punching frame, and said punching frame includes a cylinder 21, a cylinder mounting plate 22, a side fixing plate 23, a mounting block 24, a mol...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a continuous die for a mainboard support of a notebook computer. The continuous die comprises a working table (1), and the working table (1) is provided with a punching die (2) for punching a to-be-machined piece (5), a punching cutter die (3) for stamping and impressing the to-be-machined piece (5), a bending die (4) for stamping and forming the to-be-machined piece (5) and a conveying device (6) for conveying the to-be-machined piece (5) in sequence. According to the continuous die, continuous formation of the support is achieved through multiple dies, and a processproduction mode is formed.

Description

technical field [0001] The invention relates to a mold, in particular to a continuous mold for a notebook computer motherboard support. Background technique [0002] For the stamping of notebook stand accessories, the single-station mold has a single structure and low production efficiency, while the complex mold has fewer stations, which is not conducive to stamping. Continuous die, using strip-shaped stamping raw materials, uses several different stations on a pair of dies to complete multiple stamping processes at the same time. The die is not stamped once, and the raw materials are driven to move a certain distance until the product processing is completed. [0003] The notebook main board bracket needs to be equipped with installation and connection parts, and there are sound installation holes and multiple USB installation holes. The bracket structure is complex and needs to be produced with continuous molds. [0004] In view of the above-mentioned defects, the design...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B21D37/08
CPCB21D37/08
Inventor 章华亮
Owner 江苏杰邦电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com