Thermopile infrared detector and 360-degree look-around array detecting device using detector

Abstract

The invention relates to a thermopile infrared sensor array design technology, in particular to a thermopile infrared detector and a 360-degree look-around array detecting device using the detector. According to the invention, eight CMOS (Complementary Metal Oxide Semiconductor) process-based MEMS (Micro-electromechanical System) thermopile infrared sensors are adhered onto a packaging base; respective thermopile lead wire bonding pads and pins of the packaging base are bonded with lead wires through a bonding process; the bonded structure is placed in the center of a photoelectric detecting table; eight thermopiles respectively correspond to the centers of eight tapered holes of the photoelectric detecting table; the photosensitive surfaces of the thermopiles are outward along an opticalpassageway; and infrared optical lenses coated with antireflection films are respectively arranged in the tapered holes in the photoelectric detecting table. The structure can sense a moving target around at a far distance; and after the target enters a sensing visual field, an infrared signal irradiated by the target enters the photoelectric detecting table through the infrared optical lenses andthen is focused on the photoelectric sensing surfaces of the thermopile infrared sensors through the tapered optical passageway, thus finally realizing 360-degree full-view sensing of the target.

Description

technical field [0001] The invention relates to a thermopile infrared sensor array design technology, in particular to a thermopile infrared detector and a 360° surround-view array detection device using the detector. Background technique [0002] Infrared sensor is a key part of infrared detection, which plays an important role in both military and civilian fields. Infrared temperature measurement, infrared detection, infrared imaging, etc. are all important applications of infrared sensors. The thermopile infrared detector is a widely used infrared sensor. It utilizes the shell effect and consists of two different materials to form a cold end and a hot end respectively, forming a closed loop, and a voltage difference will be generated under a temperature difference. Existing thermopile infrared sensors are mainly manufactured by mems technology, and the package type is mainly To package, including single window, double window, etc. Due to the advantages of small size, low...

AI Technical Summary

Problems solved by technology

However, due to size constraints, it is impossible to achieve more window packages. The same package sensor can only be tested in one direction, and the detection field of view is limited. Therefore, the design of the thermopile sensor array is also affected.

At present, the thermopile infrared sensor array design mainly uses a plurality of individually packaged infrared sensors to form a sensor array, which is relatively large in size. If an optical lens is added, the size will increase multiple times, which also brings a larger range of application to the sensor array. limit

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