Wafer defect pattern classification method and device, storage medium, and electronic device
A defect mode and classification method technology, applied in the computer field, can solve the problems of low accuracy, low efficiency, and heavy classification workload.
Active Publication Date: 2019-01-18
CHANGXIN MEMORY TECH INC
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[0006] The purpose of the present disclosure is to provide a wafer defect mode classification method and device, storage medium, and electronic equipment, and then at least to a certain extent overcome the heavy classification workload, high labor cost, and low efficiency caused by manual labeling and classification methods , the problem of low accuracy
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[0063] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar parts in the drawings, and thus their repeated descriptions will be omitted.
[0064] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or mo...
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The present disclosure relates to the field of computer technology, in particular to a wafer defect pattern classification method and apparatus, a storage medium, and an electronic device. The methodcomprises the following steps of: obtaining a wafer image marked with a defect position; Extracting features of the wafer image by using a convolution neural network to obtain feature data of the wafer image; Encoding characteristic data of the wafer image by an automatic encoder to generate characteristic encoding of the wafer image; Clustering feature codes of a plurality of the wafer images, and classifying defect patterns of each of the wafer images based on the clustering results. The invention greatly reduces the labor workload, further greatly reduces the human cost, and also greatly improves the classification efficiency and the classification accuracy rate. In addition, the invention can be directly connected with the EDA system, and improves the ability of processing the massivedata.
Description
technical field [0001] The present disclosure relates to the field of computer technology, and in particular to a wafer defect mode classification method and device, a storage medium, and electronic equipment. Background technique [0002] In the process of semiconductor production, each chip in each wafer must undergo a series of tests to judge whether each chip is good or bad (that is, whether it passes the test), and then judge whether the wafer meets the requirements of the standard according to the quality of each chip. Production standards. Usually, wafers that do not meet production standards have some specific defect modes. Different defect modes can often reflect problems in the design and production process. Therefore, classifying the defect modes of wafers that do not meet production standards has become a semiconductor production process. one of the important issues in . [0003] At present, the defect modes of the wafers that do not meet the production standar...
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IPC IPC(8): G06K9/62G06K9/00
CPCG06V20/00G06F18/23G06F18/2155G06V10/82G06F18/24G01N21/9501G01N21/956
Inventor 潘晓东
Owner CHANGXIN MEMORY TECH INC