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Novel ultrathin adhesive-free copper-clad plate and manufacturing method thereof

A manufacturing method and technology for copper clad laminates, which are applied to manufacturing tools, accessories of shearing machines, shearing machine equipment, etc., can solve the problems of complicated operation, single function, large cutting size error, etc., and achieve the effect of simple and efficient replacement operation.

Inactive Publication Date: 2019-01-22
众顶(广州)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When producing adhesive-free copper-clad laminates, it is necessary to cut and process the adhesive-free copper-clad laminates. The current cutting equipment usually only has a one-way cutting function, and its function is single. It is necessary to manually adjust the direction of the adhesive-free copper-clad laminates during cutting. The operation is cumbersome and the work efficiency is low. Moreover, the cutting process of the glueless copper clad laminate requires manual control operation, the cutting size error is large, and the replacement steps of the rotating cutter body are cumbersome. Therefore, it needs to be improved.

Method used

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  • Novel ultrathin adhesive-free copper-clad plate and manufacturing method thereof
  • Novel ultrathin adhesive-free copper-clad plate and manufacturing method thereof
  • Novel ultrathin adhesive-free copper-clad plate and manufacturing method thereof

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Embodiment Construction

[0016] Combine below Figure 1-4 The present invention will be described in detail.

[0017] refer to Figure 1-4 , according to a novel ultra-thin adhesive-free copper-clad laminate and its manufacturing method according to an embodiment of the present invention, it uses an ultra-thin adhesive-free copper-clad laminate equipment, and the ultra-thin adhesive-free copper-clad laminate equipment includes a processing seat 16 And the lifting element that is arranged on the lower side of the processing seat 16, the bottom end surface of the processing seat 16 is provided with an assembly groove 34, the assembly groove 34 is provided with a rotating cutter body 13, and the left and right sides of the rotating cutter body 13 A convex handle 71 is fixed symmetrically on the center of the end surface, a first spline cavity 75 is provided in the left end surface of the convex handle 71 on the left side, and an insertion cavity 76 is provided in the right end surface of the right conve...

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Abstract

The invention discloses a novel ultrathin adhesive-free copper-clad plate and a manufacturing method thereof. An ultrathin adhesive-free copper-clad plate device is used by the manufacturing method and comprises a machining base and a lifting element arranged on the lower side of the machining base, wherein the bottom end face of the machining base is provided with an assembly groove, a rotary cutter body is arranged in the assembly groove, the centers of the left and right side end faces of the rotary cutter body are symmetrically and fixedly provided with protruding handles, a first spline cavity is formed in the left side end face of the protruding handle on the left side, an insertion cavity is formed in the right side end face of the protruding handle on the right side, a first conveying cavity vertically extends in the machining base on the left side of the assembly groove, the lower side of the first conveying cavity is provided with a first rotary rod through rotary fitting, the outer surface of the first rotary rod is fixedly provided with a first conveying wheel, the tail end of the right side of the first rotary rod extends into the assembly groove and is fixedly provided with a first spline shaft, the first spline shaft is in matched connection with the first spline cavity through a spline, and the top wall of the first conveying cavity is communicated with a secondconveying cavity.

Description

technical field [0001] The invention relates to the technical field of glue-free copper-clad laminate processing, in particular to a novel ultra-thin glue-free copper-clad laminate and a manufacturing method thereof. Background technique [0002] When producing adhesive-free copper-clad laminates, it is necessary to cut and process the adhesive-free copper-clad laminates. The current cutting equipment usually only has a one-way cutting function, and its function is single. It is necessary to manually adjust the direction of the adhesive-free copper-clad laminates during cutting. The operation is cumbersome and the work efficiency is low. Moreover, the cutting process of the glueless copper-clad laminate requires manual control operation, the cutting size error is large, and the replacement steps of the rotating cutter body are cumbersome. Therefore, it needs to be improved. Contents of the invention [0003] The object of the present invention is to provide a novel ultra-t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23D19/08B23D33/00
CPCB23D19/08B23D33/00
Inventor 曾志华
Owner 众顶(广州)科技有限公司