A solder resist manufacturing method for preventing pcb small holes from entering ink

A production method and ink technology, applied in the manufacture of printed circuits, printed circuits, electrical components, etc., to achieve the effect of ensuring, strengthening and increasing the bonding force

Active Publication Date: 2021-02-26
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the existing technical defects and provide a solder mask manufacturing method that prevents the small holes of the PCB from entering the ink. This method solves the problem of the ink entering the holes and improves the quality of the PCB.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a method for manufacturing a circuit board, which includes a method for manufacturing a solder mask that prevents PCB holes from entering ink. The specific process is as follows:

[0024] (1) Cutting: cut out the core board according to the board size 520mm×620mm, the thickness of the core board is 0.075mm, and the thickness of the outer layer of copper foil is 1OZ.

[0025] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the core board, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to 5-6 grids The exposure ruler (21-grid exposure ruler) completes the exposure of the inner layer circuit on the core board; the inner layer is etched, and the exposed and developed core board is etched out of the inner layer circuit, and the inner layer line width is measured as 3mil; the inn...

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Abstract

The invention discloses a solder resist manufacturing method for preventing PCB small holes from entering ink, comprising the following steps: sticking a film on a production board on which an outer layer circuit has been prepared; then forming a cover hole pattern on the production board through exposure and development; Cover the hole without solder resist with the above cover hole pattern; then bake the production board; then spray ink on the production board and solidify to form a solder resist layer, and finally remove the film. The method of the invention solves the problem of ink entering the hole by adopting the method of making the cover hole pattern before solder resisting, and improves the quality of the PCB.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a solder resist production method for preventing PCB small holes from entering ink. Background technique [0002] The conventional production process of printed circuit boards includes: material cutting→inner layer graphics→inner layer etching→inner layer AOI→browning→pressing→drilling→copper sinking→full board plating→outer layer graphics→graphic plating→outer layer Etching→outer layer AOI→solder mask→surface treatment→electrical test→FQC→FQA→packaging. Among them, solder resistance refers to that on the PCB where the outer circuit has been made, except for the pads and holes that customers need to solder and insert, other areas are coated with a layer of solder resist ink and the ink is cured to protect the PCB. , solder mask, etc.; the process of solder mask includes: board → grinding plate → silk screen solder mask → pre-baking → exposure → developme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 黄力寻瑞平杨润伍陈建华罗家伟
Owner JIANGMEN SUNTAK CIRCUIT TECH
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