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Array substrate, display device using the same, and manufacturing method of the substrate and device

A technology for array substrates and manufacturing methods, applied in the field of electronic devices and their manufacturing, capable of solving problems such as complex processes and damage to the entire array substrate, and achieving the effects of simple manufacturing methods, improved production yields, and optimized production yields

Active Publication Date: 2021-06-04
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of array substrates, it is relatively complicated to form electronic components on two opposite sides of a bare substrate.
Moreover, as long as the electronic components on one side are damaged, the entire array substrate will be damaged regardless of whether the electronic components on the other side are damaged

Method used

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  • Array substrate, display device using the same, and manufacturing method of the substrate and device
  • Array substrate, display device using the same, and manufacturing method of the substrate and device
  • Array substrate, display device using the same, and manufacturing method of the substrate and device

Examples

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Embodiment Construction

[0080] Figure 1A is a flow chart of a method for manufacturing an array substrate according to the first embodiment of the present invention. Figure 1B to Figure 1H is a partial cross-sectional schematic diagram of a method for manufacturing an array substrate according to the first embodiment of the present invention. Figure 1I It is a partial top view of a partial manufacturing method of an array substrate according to the first embodiment of the present invention. Figure 1J It is a three-dimensional schematic diagram of a partial manufacturing method of an array substrate according to the first embodiment of the present invention.

[0081] Please refer to Figure 1A and Figure 1B . In step S1 , a first circuit board 110 is provided, and the first circuit board 110 includes at least one first pad 113 and at least one second pad 114 . For example, the first circuit board 110 has a first surface 110a and a third surface 110b opposite to each other. The first circuit b...

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Abstract

An array substrate includes a first circuit board, a second circuit board, an adhesive layer and at least one connection electrode. The first circuit board has a first surface. The first circuit board includes at least one first pad and at least one second pad. The second circuit board has a second surface. The second circuit board includes at least one press bonding pad. The adhesive layer is located between the first circuit board and the second circuit board. The first edge of the first wiring board, the second edge of the second wiring board, and the adhesive edge of the adhesive layer are cut substantially flush with each other. The connection electrode extends from the first surface to the second surface along the first edge, the second edge and the adhesive edge. The connection electrode is electrically connected to the second pad and the pressing pad.

Description

technical field [0001] The present invention relates to an electronic device and its manufacturing method, and in particular to an array substrate and its manufacturing method, and a display device using the array substrate and its manufacturing method. Background technique [0002] In the process of array substrates, forming electronic elements on two opposite surfaces of a bare substrate is relatively complicated in process. Moreover, as long as the electronic components on one surface are damaged, the entire array substrate will be damaged regardless of whether the electronic components on the other surface are damaged. Contents of the invention [0003] The invention provides an array substrate and a manufacturing method thereof. The manufacturing method is relatively simple and has better manufacturing yield. [0004] The array substrate of the present invention includes a first circuit board, a second circuit board, an adhesive layer and at least one connecting elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77H01L27/15
CPCH01L27/124H01L27/1259H01L27/156
Inventor 林宜欣黄朝伟陈正欣
Owner AU OPTRONICS CORP
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