A fast bonding device for square composite boards

Abstract

The invention discloses a quick adhesion device for square composite plates. The quick adhesion device comprises a base, an enclosure frame and a pressing piece; the side wall of the base is providedwith inserting groove openings, and carrying plates are inserted into the inserting groove openings; the top surface of the base is provided with vertical columns, and the top ends of the vertical columns are fixedly connected to the bottom surface of a top plate; the enclosure frame is fixedly connected to the bottom surface of the top plate, and the side wall of the enclosure frame is provided with a feeding inlet, and a butt-joint groove opening is formed below the feeding inlet. According to the square composite plate quick adhesion device provided by the invention, a layer of plate is putinto the base, the height of the groove openings of the base is adjusted according to the quantity of layers of the plates, another layer of plate is put in the enclosure frame to be smeared with anadhesive, adhesion of the two layers of plates is achieved by pushing the pressing piece downwards, operation is easy and convenient, and based on a carrying piece at the bottom, the plate butt-jointaccuracy is improved.

Description

technical field [0001] The invention relates to the technical field of composite board processing, in particular to a quick bonding device for square composite boards. Background technique [0002] Composite board refers to a layer of board covered with another board to achieve the effect of saving resources and reducing costs without reducing the use effect (anti-corrosion performance, mechanical strength, etc.). The composite method usually includes explosive composite method. Explosive rolling compounding, rolling compounding and bonding compounding are mainly used in anti-corrosion, pressure vessel manufacturing, power construction, petrochemical, pharmaceutical, light industry, automobile and other industries, but it still has the following disadvantages in actual processing: [0003] 1. For the processing of composite boards, at least two layers of boards need to be superimposed, but in the traditional method, after applying adhesive on the surface of one layer of boar...

AI Technical Summary

Problems solved by technology

[0003] 1. For the processing of composite boards, at least two layers of boards need to be superimposed, but in the traditional method, after applying adhesive on the surface of one layer of boards, the other layer of boards is directly superimposed on the board coated with adhesive, which is prone to offset misalignment;

[0004] 2. The traditional composite board processing device is troublesome to apply adhesive on both sides of the same board, and the application is uneven, which affects the bonding quality of the board;

[0005] 3. The traditional composite panel processing setup is simple in structure and inconvenient to operate, resulting in low bonding efficiency of the panels

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