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Heat dissipation type outer shell structure used for portable electronic products

A heat-dissipating technology for electronic products, applied in the field of heat-dissipating shell structures, can solve problems such as the inability to guarantee that electronic products will not fall, the inability to fix electronic products, and the lack of anti-drop functions, so as to achieve heat dissipation and protect electronic products and structures Simple, secure effect

Inactive Publication Date: 2019-02-12
合肥景彰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned shortcomings existing in the prior art, the present invention provides a heat-dissipating housing structure for portable electronic products, which can effectively overcome the problems existing in the prior art that it does not have a shock-absorbing function and cannot fix electronic products, resulting in the inability to guarantee Electronic products do not fall during use, have no anti-drop function, and have limited heat dissipation effects

Method used

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  • Heat dissipation type outer shell structure used for portable electronic products
  • Heat dissipation type outer shell structure used for portable electronic products
  • Heat dissipation type outer shell structure used for portable electronic products

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0032] A heat-dissipating housing structure for portable electronic products, such as Figure 1 to Figure 7 As shown, it includes a housing 1 and bolts 13, a filter 3 is fixed on the top of the housing 1, an exhaust fan 2 is fixedly installed under the filter 3, a heat sink 4 is fixed on the inner bottom of the housing 1, and the opposite side of ...

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Abstract

The invention relates to the technical field of electronic products, in particular to a heat dissipation type outer shell structure used for portable electronic products. The structure comprises an outer shell and bolts, wherein a filter screen is fixed to the top of the outer shell; an air extraction fan is fixedly mounted below the filter screen; a heat dissipation device is relatively fixed tothe inner bottom of the outer shell; the opposite side surfaces of the heat dissipation device are open; heat dissipation plates are fixed to the heat dissipation device; the heat dissipation plates are arranged in the heat dissipation device in a winding manner; first heat dissipation holes are relatively formed in the side wall of the outer shell; an object placing frame is fixed to the top of the outer shell; second heat dissipation holes are formed in the object placing frame; a first limiting plate is fixed to one end of the object placing frame; a first rubber sheet is fixed to the sidesurface of the first limiting plate; and a second limiting plate is fixed to the other end of the object placing frame. The technical scheme can effectively overcome the defects that the electronic products cannot be guaranteed not to drop during use due to the structure which does not have a shock-absorbing function and cannot fix the electronic products in the prior art, and the structure does not have an anti-drop function, and the heat dissipation effect is limited.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a heat dissipation shell structure for portable electronic products. Background technique [0002] With the development of social economy and the improvement of people's living standards, people use more and more electronic products. Traditional electronic product shells use cooling fans to dissipate heat, but the cooling effect is not good, making the electronic products inside The temperature cannot drop quickly, which leads to the lack of a good working environment for electronic products. Working for a long time will cause damage to the internal components of electronic products, which increases the frequency of maintenance or replacement of internal components of electronic products and affects the user experience. Therefore, a The heat-dissipating housing structure for portable electronic products is the key to solve the problem. [0003] In the invention paten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/2039
Inventor 王志纯
Owner 合肥景彰科技有限公司
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