High-refractive index methyl phenyl LED (light-emitting diode) packaging silicone rubber material and preparation method thereof

A technology of LED encapsulation and methyl phenyl, applied in the direction of adhesives, polymer adhesive additives, adhesive additives, etc., can solve the problems of poor mechanical properties, low light transmittance and low refractive index of LED encapsulated silicone rubber, etc. To achieve the effect of easy control of product molecular weight, high adhesion and good mechanical properties

Inactive Publication Date: 2019-02-15
WUHU YANGZHAN NEW MATERIAL TECH SERVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] According to the deficiencies in the prior art above, the technical problem to be solved by the present invention is to propose a high refractive index methyl phenyl LED packaging silicone rubber material and its preparation method, through the self-made phenyl silicon boron tackifier and the self-made Hydroxyl MDT hydrogen-containing methylphenyl silicone resin solves the problems of poor mechanical properties, low light transmittance and low refractive index of LED packaging silicone rubber. The prepared LED packaging silicone rubber material has good mechanical properties, high refractive index, High adhesiveness and good thermal stability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1. Raw materials: 10 parts of base glue: silicone oil (vinyl content is 0.21%; the amount of vinyl methyl phenyl silicone oil and hydrogen-containing methyl phenyl silicone oil is based on molar ratio n Si-H / n Si-Vi =1.3), 5 parts of crosslinking agent: select phenyl hydrogen-containing silicone oil with hydrogen content of 0.3% and viscosity of 105mPa·s, 1 part of Speier catalyst, 5 parts of phenyl silicon boron tackifier: phenyl content of 45%, boron Content 2.0mmol / g, vinyl content 1.0mmol / g, 10 parts of reinforcing agent: 5 parts of phenyl MQ silicone resin (M / Q=0.8, solid content at 50%, viscosity 5000cs) and MDT hydrogen-containing methylbenzene Base silicone resin 5 parts, inhibitor 1 part.

[0024] 2. Preparation of MDT hydrogen-containing methylphenyl silicone resin: Take 85g of phenyltrimethoxysilane, 60g of hydroxy-terminated methylphenylsiloxane and 36g of CH-01 type acidic cationic resin and add them to the In a four-necked flask with an instrument and a...

Embodiment 2

[0029] 1. Raw materials: 15 parts of base glue: silicone oil (vinyl content is 2.21%; the amount of vinyl methyl phenyl silicone oil and hydrogen-containing methyl phenyl silicone oil is based on molar ratio n Si-H / n Si-Vi =1.4), 8 parts of cross-linking agent: select phenyl hydrogen-containing silicone oil with hydrogen content of 0.3%, viscosity of 105mPa·s, 2 parts of Karstedt catalyst, 8 parts of phenyl silicon boron tackifier: phenyl content of 45%, boron content 2.0mmol / g, vinyl content 1.0mmol / g, 20 parts of reinforcing agent: 10 parts of phenyl MQ silicone resin (M / Q=0.9, solid content of 50%, viscosity 6000cs), MDT hydrogen-containing methylbenzene Base silicone resin 10 parts, inhibitor 2 parts.

[0030] 2. Preparation of MDT hydrogen-containing methylphenyl silicone resin: Take 85g of phenyltrimethoxysilane, 100g of hydroxy-terminated methylphenylsiloxane and 36g of CH-01 type acidic cationic resin and add them to the In a four-necked flask with a device and a th...

Embodiment 3

[0035] 1. Raw materials: 27 parts of base glue: silicone oil (vinyl content is 3.87%; the amount of vinyl methyl phenyl silicone oil and hydrogen-containing methyl phenyl silicone oil is based on molar ratio n Si-H / n Si-Vi =1.5), 10 parts of crosslinking agent: select phenyl hydrogen-containing silicone oil with hydrogen content of 0.3%, viscosity of 105mPa·s, 1 part of Speier catalyst and 2 parts of Karstedt catalyst, 15 parts of phenyl silicon boron tackifier: phenyl Content 45%, boron content 2.0mmol / g, vinyl content 1.0mmol / g, reinforcing agent 50 parts: 25 parts of phenyl MQ silicone resin (M / Q=1.0 and solid content at 50%, viscosity 7000cs) and MDT 25 parts of hydrogen-containing methylphenyl silicone resin, 3 parts of inhibitor.

[0036] 2. Preparation of MDT hydrogen-containing methylphenyl silicone resin: Take 85g of phenyltrimethoxysilane, 120g of hydroxy-terminated methylphenylsiloxane and 36g of CH-01 type acidic cationic resin and add them to the In a four-neck...

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Abstract

The invention discloses a high-refractive index methyl phenyl LED (light-emitting diode) packaging silicone rubber material and a preparation method thereof. The high-refractive index methyl phenyl LED packaging silicone rubber material comprises the following raw materials in parts by weight: 5-27 parts of base rubber, 5-10 parts of a crosslinking agent, 0.1-3 parts of a catalyst, 0.5-15 parts ofa phenyl silicon boron tackifier, 10-50 parts of a reinforcing agent and 1-3 parts of an inhibitor. The methyl phenyl LED packaging silicone rubber material has good mechanical properties and excellent heat resistance, has the light transmittance being as high as 95% and has good heat stability; a technology is simple, the molecular weight of a product is convenient to control, the product is unlikely to gel; and the material is the high-refractive index methyl phenyl LED packaging silicone rubber material.

Description

technical field [0001] The invention belongs to the technical field of encapsulating silicone rubber materials, and in particular relates to a high refractive index methylphenyl LED encapsulating silicon rubber material and a preparation method thereof. Background technique [0002] As a new type of solid light source, light-emitting diode (LED) has the advantages of energy saving, environmental protection, long service life, and fast response compared with traditional lighting devices. It has been widely used in many fields such as display backlight, traffic signal lights, automotive light sources, and general lighting. . Due to defects such as large internal stress, easy yellowing at high temperature, and poor radiation resistance, traditional epoxy resin packaging materials are difficult to meet the packaging requirements of power LEDs. Silicone materials have excellent comprehensive properties and become an ideal choice for LED packaging. The preparation of high-perfor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J183/04C09J11/08C08G77/398C08G77/16C08G77/12C08G77/06
CPCC08G77/06C08G77/12C08G77/16C08G77/398C08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/08C09J183/04C08L83/04C08L83/08
Inventor 张春松
Owner WUHU YANGZHAN NEW MATERIAL TECH SERVICE CO LTD
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