Unlock instant, AI-driven research and patent intelligence for your innovation.

igbt junction temperature monitoring system

A technology of monitoring system and temperature control equipment, applied in instruments, measuring devices, measuring electricity and other directions, can solve the problems of complex circuit structure and low monitoring reliability, and achieve the effect of reducing the risk of device failure and realizing over-temperature protection.

Active Publication Date: 2021-07-30
CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an IGBT junction temperature monitoring system for the traditional IGBT junction temperature monitoring circuit with complex structure and low monitoring reliability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • igbt junction temperature monitoring system
  • igbt junction temperature monitoring system
  • igbt junction temperature monitoring system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. A preferred embodiment of the application is shown in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an IGBT junction temperature monitoring system, which includes processing equipment, a data acquisition device respectively connected to the processing equipment, and a junction temperature control device; the data acquisition device includes a temperature control device, a first driving device, and a first collection device; the temperature control device The IGBT device to be tested is installed in the center; the first driving device is connected to the IGBT device to be tested; the first collection device is connected between the emitter and the collector of the IGBT device to be tested; the temperature control device, the first driving device and the first collection device The processing equipment is respectively connected; the junction temperature control device includes a temperature adjustment device, a second driving device, and a second acquisition device; the temperature adjustment device is installed with an IGBT device to be tested; the second driving device is connected to the IGBT device to be tested; the second acquisition device is connected to the Between the collector and emitter of the IGBT device under test. The embodiment of the present invention can realize the monitoring of the IGBT junction temperature, simplify the circuit structure of the IGBT junction temperature monitoring system, and improve the reliability of monitoring.

Description

technical field [0001] The invention relates to the technical field of semiconductor device testing, in particular to an IGBT junction temperature monitoring system. Background technique [0002] The performance and lifetime of semiconductor devices are greatly affected by temperature, especially for power devices. Power devices are affected by high power during operation, which will generate a lot of heat, causing the temperature of the device to rise. IGBT is a kind of semiconductor power device, which is widely used in modern power electronics technology. A large amount of heat is generated during the operation of the IGBT, and the heat is mainly generated at the PN junction, which is manifested as an increase in the junction temperature of the device, so the junction temperature of the IGBT is one of the important parameters that affect the performance of the IGBT. The effective monitoring of the IGBT junction temperature can realize the over-temperature protection of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601G01R31/2619
Inventor 肖庆中周斌严伟恩云飞黄云
Owner CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST