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A method and apparatus for temperature control

A control device and positioning technology, applied in the computer field, can solve problems such as equipment downtime, failure to be detected, and burnt out

Inactive Publication Date: 2019-02-22
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally speaking, the heat dissipation strategy of these devices is to adjust the fan speed according to the device temperature monitored by the baseboard management controller (BMC) on the server, but when the device fails during operation, the baseboard management controller cannot monitor When the temperature of the device is reached, the existing temperature control strategy will not control the temperature of the device
However, if the temperature of the device continues to rise and the baseboard management controller does not control the fan speed to increase, the device may be down or even burned

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] See figure 1 , the temperature control method provided in the embodiment of the present application, including:

[0045] S10: Read the temperature of the on-site equipment loaded on the server.

[0046] The in-place device refers to the device in the running state on the server after the server is powered on.

[0047] Each device loaded on the server is equipped with a temperature sensor, which can measure the temperature of the on-site device in real time. In this step, the BMC on the server will read the temperature of the temperature sensor on each on-site device in a loop. In this way, the corresponding temperature of each in-position device loaded on the server can be read.

[0048] S11: Determine whether the temperature of the device in place is within a preset range, if yes, execute S12; if not, execute S13.

[0049] Wherein, the preset range may be obtained by performing multiple tests on the device, and the allowable temperature range of the device under the...

Embodiment 2

[0069] See figure 2 , another temperature control method provided in the embodiment of the present application, including:

[0070] S20: Determine whether the device loaded on the server is in place, if yes, execute S21; if not, the device does not participate in temperature regulation. ,

[0071] There are many methods for judging whether the device loaded on the server is in place, and in this embodiment of the application, it may specifically include:

[0072] After the server is powered on, read the temperature of the equipment loaded on the server cyclically;

[0073] If the temperature of the device loaded on the server can be read, the device is in place;

[0074] If the temperature of the device loaded on the server cannot be read, the device is not in place.

[0075] It should be noted that, when the device is in place, the device belongs to the target device that needs temperature regulation. Additionally, when equipment is in place, may include:

[0076] S21:...

Embodiment 3

[0083] see image 3 , the temperature control device provided by the application, including:

[0084] The reading unit 31 is used to read the temperature of the on-site equipment loaded on the server;

[0085] A first judging unit 32, configured to judge whether the temperature of the in-position equipment is within a preset range;

[0086] The first control unit 33 is configured to control the fan to regulate the temperature of the device according to the first fan speed regulation method if the temperature of the device in place is within a preset range;

[0087] The second judging unit 34 is used for judging whether the temperature of the on-site equipment returns to the preset range within a preset time if the temperature of the on-site equipment is not within the preset range;

[0088] A trigger unit 35, configured to trigger the first control unit when the temperature of the in-position device returns to a preset range within a preset time;

[0089] The second control...

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PUM

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Abstract

A method and apparatus for temperature control is disclosed. The method comprises the following steps of: when the temperature of an in-place device is not within a preset range, if yes, if the temperature of the in-place device is restored to a preset range within a preset time, the fan speed is regulated according to the first fan speed regulating mode, Otherwise, the fan speed is regulated according to the second fan speed regulating mode, thereby realizing the temperature regulation of the on-site equipment, thereby heat dissipation can be carried out on the on-site equipment which suddenly fails in the operation process of the server, and the on-site equipment can be prevented from being out of service or even burned due to the high temperature.

Description

technical field [0001] The present application relates to the field of computer technology, in particular to a temperature control method and device. Background technique [0002] With the rapid development of the Internet, the requirements for computing and storage are getting higher and higher, and high-performance servers can provide massive storage and fast computing. In order to prevent the server from crashing due to excessive computation, more and more storage and computing devices are loaded into the server. Most of these devices run continuously for a long time, and the heat dissipation is extremely large. [0003] Generally speaking, the heat dissipation strategy of these devices is to adjust the fan speed according to the device temperature monitored by the baseboard management controller (BMC) on the server, but when the device fails during operation, the baseboard management controller cannot monitor When the temperature of the device is reached, the existing ...

Claims

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Application Information

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IPC IPC(8): G06F11/30G06F1/20
CPCG06F11/3058G06F1/20
Inventor 范雪峰梁昊
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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