Inhomogeneous magnetic foils embedded in component carriers
A component-carrying, uniform technology used in printed circuit components, semiconductor/solid-state device components, electrical components, etc.
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[0059] Before describing example embodiments in more detail with reference to the drawings, some basic considerations upon which example embodiments of the present invention are developed will be summarized.
[0060] According to an example embodiment of the invention, one or more (in particular integral or connected, or separated into separate islands) magnetic layers are embedded in the component carrier such that the one or more magnetic layers have Uneven shape or structure.
[0061] Magnetic foils such as ferrite foils, soft magnetic foils, foils based on nanocrystalline magnetic materials etc. have been found to have suitable adhesion properties with respect to component carriers, especially resin sheets such as prepreg materials. At the same time, such magnetic foils even meet the challenging reliability requirements of component carriers.
[0062] When embedding such magnetic foils into a component carrier material, it may be necessary to cut out certain structures an...
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