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Inhomogeneous magnetic foils embedded in component carriers

A component-carrying, uniform technology used in printed circuit components, semiconductor/solid-state device components, electrical components, etc.

Active Publication Date: 2021-11-26
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, effective protection against electromagnetic interference (EMI) has become an increasingly prominent issue

Method used

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  • Inhomogeneous magnetic foils embedded in component carriers
  • Inhomogeneous magnetic foils embedded in component carriers
  • Inhomogeneous magnetic foils embedded in component carriers

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0059] Before describing example embodiments in more detail with reference to the drawings, some basic considerations upon which example embodiments of the present invention are developed will be summarized.

[0060] According to an example embodiment of the invention, one or more (in particular integral or connected, or separated into separate islands) magnetic layers are embedded in the component carrier such that the one or more magnetic layers have Uneven shape or structure.

[0061] Magnetic foils such as ferrite foils, soft magnetic foils, foils based on nanocrystalline magnetic materials etc. have been found to have suitable adhesion properties with respect to component carriers, especially resin sheets such as prepreg materials. At the same time, such magnetic foils even meet the challenging reliability requirements of component carriers.

[0062] When embedding such magnetic foils into a component carrier material, it may be necessary to cut out certain structures an...

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PUM

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Abstract

A component carrier (100) and a method of manufacturing the component carrier (100) are provided, wherein the component carrier (100) comprises: a stack (102) comprising a plurality of electrically insulating layer structures ( 104) and / or a plurality of conductive layer structures (106); and a non-uniform magnetic foil (108) integrated in the stack (102).

Description

technical field [0001] The invention relates to a method for producing a component carrier and to a component carrier. Background technique [0002] Against the background of the increasing product functions of component carriers, especially component carriers equipped with one or more electronic components, and the increasing miniaturization of component carriers and the increasing functional requirements of More powerful component carriers are frequently used, which have a plurality of contacts or contact points with ever-decreasing spacing between the contacts. In addition, effective protection against electromagnetic interference (EMI) has also become an increasingly prominent issue. At the same time, the component carrier should be mechanically robust and electrically reliable in order to be able to operate even under harsh conditions. In addition, users have requirements for extended functionality of the component carrier. Contents of the invention [0003] It is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H01L23/552H01L23/498
CPCH01L23/49822H01L23/552H05K1/0213H05K1/0298H05K1/0224H05K1/0225H05K1/0227H05K2201/0723H05K2201/083H05K1/0233H05K3/4658H05K1/188
Inventor 杰拉尔德·魏丁格尔乔纳森·西尔瓦诺·德索萨
Owner AT & S AUSTRIA TECH & SYSTTECHN AG