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Dimension measuring method, device and terminal equipment of semiconductor ic components

A measurement method and component technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problem of inaccurate dimensions of measurement components

Active Publication Date: 2021-09-14
东莞市北井光控科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the embodiment of the present application provides a semiconductor IC component size measurement method, device and terminal equipment to solve the problem of inaccurate measurement of component size in the prior art

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  • Dimension measuring method, device and terminal equipment of semiconductor ic components
  • Dimension measuring method, device and terminal equipment of semiconductor ic components
  • Dimension measuring method, device and terminal equipment of semiconductor ic components

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Embodiment Construction

[0085] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0086] In order to illustrate the technical solutions described in this application, specific examples are used below to illustrate.

[0087] see Figure 1 to Figure 7 , which is a preferred embodiment provided by the present invention, and this embodiment relates to a method for measuring the size of semiconductor IC components, wherein, the semiconductor IC components in this embo...

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Abstract

The present invention provides a semiconductor IC component size measurement method, device and terminal equipment, wherein the semiconductor IC component size measurement method includes: obtaining the actual size of the calibration block, and measuring the pixel size of the calibration block through a visual measurement module; The actual size of the calibration block, the pixel size of the calibration block, determine the conversion relationship between the pixel size and the actual size; obtain the pixel size of the component, and combine the conversion relationship to calculate the actual size of the component. Therefore, the actual size of the calibration block and the pixel size of the calibration block are used to determine the conversion relationship between the pixel size and the actual size, and then through the combination of the pixel size of the component and the conversion relationship, the actual size of the component can be calculated simply and accurately. size.

Description

technical field [0001] The application belongs to the field of machine vision recognition, and in particular relates to a method, device and terminal equipment for measuring the size of semiconductor IC components. Background technique [0002] In the production and processing process of components, in order to ensure the precision of components, it is usually necessary to test components, such as various semiconductor chips. At present, the more commonly used method is to inspect or measure various aspects of semiconductor products or materials through visual inspection systems, such as 3D5S visual inspection systems. [0003] However, when components are inspected by a visual inspection system, such as the 3D5S optical module, the actual size obtained by the 3D5S optical module is not the actual size of the component, so the 3D5S optical module must be calibrated first. However, the traditional calibration algorithm is not applicable here. First, because the field of view...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/00G01B11/02G01B11/06
CPCG01B11/00G01B11/02G01B11/0608
Inventor 张伟峰黎前军
Owner 东莞市北井光控科技有限公司
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