A kind of manufacturing method of local thick copper printed circuit board
A printed circuit board and local thick copper technology, which is applied in the fields of printed circuit manufacturing, printed circuit, multi-layer circuit manufacturing, etc., can solve the problems of low production cost, waste of materials, complicated process, etc.
Active Publication Date: 2020-10-27
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0006] The present invention aims at the problems of waste of materials, high cost or complex process and difficult realization in the existing method of manufacturing circuit boards with local thick copper positions whose copper thickness is greater than or equal to 0.8mm, and provides a relatively simple and easy process that can produce partially thick The manufacturing method of the printed circuit board with the thickness of the copper bit greater than or equal to 0.8mm, the qualified rate is high, and the production cost is low
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Embodiment
[0023] This embodiment provides a method for making a local thick copper printed circuit board. The position where the local copper thickness is thicker is called the local thick copper position. The copper thickness of the local thick copper position is 1 mm, and the thickness of the finished printed circuit board is 1.6 mm. mm, including the following steps:
[0024] (1) Cutting: open the core board according to the size of the panel required by the design, and the thickness of the core board is 0.6mm.
[0025] (2) Inner layer etching: the copper foil on one side of the two core boards is etched away to form a core board with copper foil on one side.
[0026] (3) Groove: On the core board, there is a local groove in the area where the local thick copper position is to be formed. The shape and size of the local groove are consistent with the shape and size of the local thick copper position to be formed.
[0027] (4) Stacked boards: stack prepregs between the two core boards...
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Abstract
The invention relates to the technical field of circuit board production, in particular to a method for producing a local thick copper printed circuit board. The present invention firstly removes the copper foil on one side of the core board and forms a local groove on the core board, and places copper blocks in the local grooves during pressing, and the copper blocks are pressed into the prepreg during pressing, so that the formed multi-layer The surface of the board is flat, which solves the problem that the post-process is difficult to carry out due to the protrusion at the local thick copper position. Through the method of the present invention, after pressing to form a multi-layer board, the production of a circuit board with a local thick copper position can be completed only by following the production process of a conventional circuit board. The process is relatively simple and easy, and the thickness of the local thick copper position can be made greater than or equal to 0.8mm printed circuit board, high pass rate and low production cost.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing a local thick copper printed circuit board. Background technique [0002] The conventional production process of printed circuit boards includes: material cutting→inner layer graphics→inner layer etching→inner layer AOI→browning→pressing→drilling→removing glue and sinking copper→board electricity→outer layer graphics→graphic plating→outside Layer etching→outer layer AOI→solder mask→surface treatment→electrical testing→FQC→packaging. In order to meet certain design requirements, it is necessary to manufacture printed circuit boards with local thick copper, but using the existing conventional production process to manufacture printed circuit boards with local copper thickness greater than or equal to 0.8mm has the following disadvantages: [0003] ① If the copper thickness of the local thick copper position is greater than or equal to 0.8mm,...
Claims
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IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/0044H05K3/4611
Inventor 王文明寻瑞平胡善勇韩磊杨林
Owner JIANGMEN SUNTAK CIRCUIT TECH