Wafer washing device

A wafer, wafer carrying technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as multi-pollutants and affecting cleaning effects

Inactive Publication Date: 2019-03-19
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a wafer scrubbing device to alleviate the technical problem in the prior art that the rolling brush produces more pollutants on the surface after cleaning multiple wafers, which affects the subsequent scrubbing effect

Method used

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Embodiment Construction

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0036] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention relates to the technical field of cleaning equipment, in particular to a wafer washing device. The wafer washing device comprises a wafer bearing assembly, an upper brush driving assembly and an upper brush cleaning platform, wherein the upper brush cleaning platform and the wafer bearing assembly are arranged at intervals, and the upper brush cleaning platform is used for cleaning an upper rolling brush arranged on the upper brush driving assembly; one end of the upper brush driving assembly is arranged on one side, close to the upper brush cleaning platform, of the wafer bearing assembly, the other end of the upper brush driving assembly can swing between the surface of the upper brush cleaning platform and the upper surface of the wafer bearing assembly so as to alleviatethe technical problem that in the prior art, a rolling brush generates more pollutants on the surface after a plurality of wafers are cleaned, and the follow-up washing effect is influenced.

Description

technical field [0001] The present invention relates to the technical field of cleaning equipment, in particular to a wafer cleaning device. Background technique [0002] In the manufacturing process of semiconductor integrated circuit chips, chemical mechanical polishing process (CMP) has many applications. Chemical mechanical polishing equipment is developing in the direction of integration, intelligence and automation. [0003] However, after the chemical mechanical polishing process (CMP), various pollutants such as organic compounds, particles, and metal ions will remain on the wafer surface. In the prior art, the use of roller brush cleaning technology in the post-CMP cleaning process can effectively remove impurities Pollution, the roller brush produces more pollutants on the surface after cleaning multiple wafers, which affects the subsequent cleaning effect. Contents of the invention [0004] The object of the present invention is to provide a wafer cleaning dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B1/04B08B3/12B08B3/02H01L21/67
CPCB08B1/002B08B1/04B08B3/02B08B3/12H01L21/67023H01L21/67046H01L21/67051
Inventor 赵宁史霄佀海燕尹影
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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