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Wafer seat cleaning method, semiconductor manufacturing method and cleaning system

A wafer seat, semiconductor technology, applied in the field of cleaning, can solve problems such as reducing the surface of the wafer seat

Active Publication Date: 2021-06-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although existing cleaning methods can reduce the contamination of the wafer seat surface to some extent, there is still room for further improvement

Method used

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  • Wafer seat cleaning method, semiconductor manufacturing method and cleaning system
  • Wafer seat cleaning method, semiconductor manufacturing method and cleaning system
  • Wafer seat cleaning method, semiconductor manufacturing method and cleaning system

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Embodiment Construction

[0043] The following disclosure provides many different embodiments, or examples, for implementing the different features of the present disclosure. The following disclosure describes specific examples of various components and their arrangements to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if it is described in the embodiment that a first feature is formed on or above a second feature, it may include the situation that the above-mentioned first feature is in direct contact with the above-mentioned second feature, and may also include additional features Formed between the above-mentioned first feature and the above-mentioned second feature, so that the above-mentioned first feature and the second feature are not in direct contact.

[0044] Spatially relative terms used hereinafter, such as "below", "below", "lower", "above", "higher" and similar terms, are for the convenience of describing an element or The re...

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Abstract

A method for cleaning a wafer seat. The cleaning method of the wafer seat includes: in the vacuum chamber, placing the cleaning device on the wafer seat; adsorbing the polymer material layer of the cleaning device to the wafer seat through the wafer seat; and when the cleaning device is adsorbed on the wafer, seat and when the first time elapses, the cleaning device is separated from the wafer seat.

Description

technical field [0001] Embodiments of the present disclosure relate to a cleaning method, in particular to a cleaning method of a wafer seat. Background technique [0002] During the manufacturing process of some semiconductor devices, the semiconductor device is placed on a wafer chuck. Over time, the surface of the wafer holder may accumulate some contaminants, such as dust particles, silicon particles, or photoresist residues. [0003] In order to reduce the impact of the above-mentioned pollutants on the semiconductor manufacturing process, a cleaning operation is generally performed on the wafer seat. Although the existing cleaning methods can reduce the contamination on the surface of the wafer seat to some extent, there is still room for further improvement. Contents of the invention [0004] An embodiment of the present disclosure provides a method for cleaning a wafer seat. The cleaning method of the wafer seat includes: in the vacuum chamber, placing the clean...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B7/00B08B13/00
CPCB08B7/0028B08B13/00
Inventor 王绍华陈梓文石世昌陈立锐郑博中
Owner TAIWAN SEMICON MFG CO LTD