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Rewiring structure for chip

A technology of re-wiring structure and re-wiring layer, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of complicated or even invalid metal pad connection, increase the test cost, etc., and achieve low cost, multiple selectivity, and use. handy effect

Active Publication Date: 2019-03-26
WUHAN XINXIN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if the position of the metal pad remains unchanged, in some specific cases, the connection of the metal pad may become complicated or even ineffective; and if the position of the metal pad is changed, different probes are required Cards are tested, which increases the cost of testing to a certain extent

Method used

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  • Rewiring structure for chip
  • Rewiring structure for chip

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0026] In a preferred embodiment, as figure 1 with figure 2 As shown, a chip rewiring structure is proposed, wherein it is applied to a chip 10 with a metal interconnection layer 20 formed on the upper surface, and a group of first metal pads are formed on the upper surface of the metal interconnection layer 20 pad1; the rewiring structure of the chip can include:

[0027] The redistribution layer 30 is formed with metal wiring 31;

[0028] The pad layer 40 is formed on the upper surface of the redistribution layer, including a group of second metal pads pad2 and a group of third metal pads pad3;

[0029] There is at least one second metal pad pad2 connected to a first metal pad pad1 through a metal connection 31;

[0030] The number of the third metal pads pad3 is the same as that of the first metal pads pad1, and each third metal pad3 is respecti...

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Abstract

The invention relates to the technical field of semiconductors, in particular, to a chip rewiring structure applied to a chip having the upper surface with a metal interconnection layer formed. Firstmetal bonding pads in a group are formed on the upper surface of the metal interconnection layer. The chip rewiring structure comprises a rewiring layer with metal connecting lines formed and a bonding pad layer. The bonding pad layer formed on the upper surface of the rewiring layer includes one group of second metal bonding pads and one group of third metal bonding pads; at least one second metal bonding pad is connected with one first metal bonding pad by the metal connecting line; the number of the third metal bonding pads is identical with that of the first metal bonding pads and each third metal bonding pad is connected with one corresponding first metal bonding pad by the metal connecting line; and the positions and distribution of the third metal bonding pads in the bonding pad layer are identical with those of the first metal bonding pads in the metal interconnection layer. The chip rewiring structure has the following beneficial effects: much selectivity is provided for metalbonding pad connection; no probe card needs to be provided additionally; and the chip rewiring structure is used conveniently with low cost.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip rewiring structure. Background technique [0002] With the development of integrated circuits, the manufacturing process of chips has become more and more perfect, and the performance of chips has also remained at a relatively high level. [0003] Generally, a metal interconnection layer including metal wiring is formed in the chip, and a metal pad connected to the top is formed through the metal interconnection layer. After the metal pads are formed, the metal pads can be used for product interconnection or packaging. At this time, it is generally necessary to test the connection of the metal pads through a test probe card, and a uniform probe card can be used to complete the test if the metal pads at a fixed position are used. [0004] However, if the position of the metal pad remains unchanged, in some specific cases, the connection of the metal pad may become ...

Claims

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Application Information

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IPC IPC(8): H01L23/485
CPCH01L23/482H01L2224/02331H01L2224/02381
Inventor 沈亮程文静
Owner WUHAN XINXIN SEMICON MFG CO LTD
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