Rewiring structure for chip
A technology of re-wiring structure and re-wiring layer, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of complicated or even invalid metal pad connection, increase the test cost, etc., and achieve low cost, multiple selectivity, and use. handy effect
Active Publication Date: 2019-03-26
WUHAN XINXIN SEMICON MFG CO LTD
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The invention relates to the technical field of semiconductors, in particular, to a chip rewiring structure applied to a chip having the upper surface with a metal interconnection layer formed. Firstmetal bonding pads in a group are formed on the upper surface of the metal interconnection layer. The chip rewiring structure comprises a rewiring layer with metal connecting lines formed and a bonding pad layer. The bonding pad layer formed on the upper surface of the rewiring layer includes one group of second metal bonding pads and one group of third metal bonding pads; at least one second metal bonding pad is connected with one first metal bonding pad by the metal connecting line; the number of the third metal bonding pads is identical with that of the first metal bonding pads and each third metal bonding pad is connected with one corresponding first metal bonding pad by the metal connecting line; and the positions and distribution of the third metal bonding pads in the bonding pad layer are identical with those of the first metal bonding pads in the metal interconnection layer. The chip rewiring structure has the following beneficial effects: much selectivity is provided for metalbonding pad connection; no probe card needs to be provided additionally; and the chip rewiring structure is used conveniently with low cost.
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