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A kind of preparation method of polyimide thick plate

A polyimide thick plate, polyimide technology, used in chemical instruments and methods, synthetic resin layered products, coatings, etc.

Active Publication Date: 2020-12-15
NINGBO JINSHAN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thickest polyimide film is only 250 microns, and it is difficult to make it thicker.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of preparation method of polyimide thick plate provided by the present embodiment comprises the following steps:

[0022] Step 1. To prepare a thermosetting polyimide film, first put the diamine into the reaction kettle, dissolve it with a polar solvent, then put the modified nano powder, and finally add the dianhydride into the reaction kettle in batches, stir, and finally Add a polar solvent to adjust and control the viscosity of the final reaction product to 90000±5000 cP, and then defoam and cast a film to obtain a thermosetting polyimide film; the modified nano-powder includes 20 parts by weight of silicon tetrafluoride , 10 parts of aluminum oxide, 30 parts of silicon oxide, 1 part of titanium oxide, 0.1 part of hafnium oxide;

[0023] Step 2, coating thermoplastic polyimide, coating one deck thermoplastic polyimide on the thermosetting polyimide film obtained above, coating thickness is at 3-7 micron, concrete step is to pass dianhydride and dihydrogen Th...

Embodiment 2

[0036] A kind of preparation method of polyimide thick plate provided by the present embodiment comprises the following steps:

[0037] Step 1. To prepare a thermosetting polyimide film, first put the diamine into the reaction kettle, dissolve it with a polar solvent, then put the modified nano powder, and finally add the dianhydride into the reaction kettle in batches, stir, and finally Add a polar solvent to adjust and control the viscosity of the final reaction product to 90000±5000 cP, and then defoam and cast a film to obtain a thermosetting polyimide film; the modified nano-powder includes 30 parts by weight of silicon tetrafluoride , 15 parts of aluminum oxide, 40 parts of silicon oxide, 5 parts of titanium oxide, 0.3 part of hafnium oxide;

[0038] Step 2, coating thermoplastic polyimide, coating one deck thermoplastic polyimide on the thermosetting polyimide film obtained above, coating thickness is at 3-7 micron, concrete step is to pass dianhydride and dihydrogen T...

Embodiment 3

[0041] A kind of preparation method of polyimide thick plate provided by the present embodiment comprises the following steps:

[0042] Step 1. To prepare a thermosetting polyimide film, first put the diamine into the reaction kettle, dissolve it with a polar solvent, then put the modified nano powder, and finally add the dianhydride into the reaction kettle in batches, stir, and finally Add a polar solvent to adjust and control the viscosity of the final reaction product to 90,000±5,000 cP, and then defoam and cast a film to obtain a thermosetting polyimide film; the modified nano-powder includes 25 parts by weight of silicon tetrafluoride , 12 parts of alumina, 35 parts of silicon oxide, 3 parts of titanium oxide, 0.2 parts of hafnium oxide;

[0043] Step 2, coating thermoplastic polyimide, coating one deck thermoplastic polyimide on the thermosetting polyimide film obtained above, coating thickness is at 3-7 micron, concrete step is to pass dianhydride and dihydrogen The p...

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Abstract

The invention discloses a method for preparing a polyimide thick plate. According to the method, the polyimide thick plate is obtained by superposing thermosetting polyimide and thermoplastic polyimide; the thickness of the polyimide thick plate is from 300 micrometers to 1000 micrometers; and non-polyimide matters such as epoxy resin or acrylic resin are not used. The obtained polyimide thick plate has a flat and smooth surface, a bonding force of more than 10 N / mm and no delamination.

Description

technical field [0001] The invention relates to a polyimide board, in particular to a preparation method of a polyimide thick board. Background technique [0002] Polyimide is being widely used in various industrial fields due to its excellent heat resistance and mechanical properties. However, the thickest polyimide film is only 250 microns, and it is difficult to make it thicker. Contents of the invention [0003] The object of the present invention is to provide a method for preparing a polyimide thick plate in order to solve the above-mentioned deficiencies in the prior art. [0004] In order to achieve the above object, a kind of preparation method of polyimide thick plate designed by the present invention comprises the following steps: [0005] Step 1. To prepare a thermosetting polyimide film, first put the diamine into the reaction kettle, dissolve it with a polar solvent, then put the modified nano powder, and finally add the dianhydride into the reaction kettle...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/06B32B27/28B32B33/00B32B37/06B32B37/10C08J7/04C08J5/18C08L79/08C08K3/34C08K3/22C08K3/36C08G73/10
CPCB32B27/06B32B27/281B32B33/00B32B37/06B32B37/1018B32B2255/10B32B2255/26C08G73/10C08J5/18C08J2379/08C08J2479/08C08K3/34C08K3/36C08K2003/2227C08K2003/2241C08J7/0427
Inventor 岑建军
Owner NINGBO JINSHAN NEW MATERIAL