A kind of preparation method of solar cell selective emitter
A solar cell and selective technology, applied in circuits, electrical components, photovoltaic power generation, etc., can solve the problems of high surface concentration and affect the performance of solar cells, achieve low surface concentration, improve emitter performance, and facilitate adjustment
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Embodiment 1
[0048] This embodiment provides a method for preparing a solar cell selective emitter, comprising the following steps:
[0049] Step 101, using HCl+H 2 o 2 and hydrofluoric acid to clean the P-type silicon substrate after texturing;
[0050] Step 102, using atmospheric pressure chemical vapor deposition (APCVD) to sequentially grow a layer of phosphosilicate glass (PSG) film (as the doping layer 2 containing the doping source) and a layer of oxide film on the entire surface of the cleaned silicon substrate 1. Silicon film (as a barrier layer 3), that is, the phosphosilicate glass film is located between the silicon oxide film and the silicon substrate 1, such as figure 1 shown;
[0051] The thickness of the phosphosilicate glass film is 100nm, the growth temperature is 480°C, and the phosphorus concentration in the grown phosphosilicate glass film is 10%;
[0052] The thickness of the silicon oxide layer is 100nm, and the growth temperature is 490°C;
[0053] Step 103, ac...
Embodiment 2
[0058] This embodiment provides a method for preparing a solar cell selective emitter, comprising the following steps:
[0059] Step 201, using HCl+H 2 o 2 and hydrofluoric acid to clean the N-type silicon substrate after texturing;
[0060] Step 202, using plasma-enhanced chemical vapor deposition (PECVD) to sequentially grow a layer of borosilicate glass (BSG) film (as a doping layer containing a doping source) and a layer of silicon oxide film on the entire surface of the cleaned silicon substrate (as a barrier layer), that is, the borosilicate glass film is located between the silicon oxide film and the silicon substrate;
[0061] The thickness of the borosilicate glass film is 60 nm, the growth temperature is 380° C., and the concentration of boron in the grown borosilicate glass film is 3.4%.
[0062] The thickness of the silicon oxide layer is 60nm, and the growth temperature is 490°C;
[0063] Step 203, according to the pattern design of the metal contact electrode...
Embodiment 3
[0068] This embodiment provides a method for preparing a solar cell selective emitter, comprising the following steps:
[0069] Step 301, using HCl+H 2 o 2 and hydrofluoric acid to clean the N-type silicon substrate after texturing;
[0070] Step 302, using plasma enhanced chemical vapor deposition (PECVD) to sequentially grow a layer of lower silicon oxide film (as a filter layer) with a thickness of 5 nm on the entire surface of the cleaned silicon substrate, and a borosilicate glass film with a thickness of 80 nm ( As a doping layer containing a dopant source), and an upper silicon oxide film (as a barrier layer) with a thickness of 80nm, that is, the phosphosilicate glass film is located between the two silicon oxide films;
[0071] Among them, the growth temperature of the lower silicon oxide film is 490°C;
[0072] The growth temperature of the borosilicate glass film is 380°C, and the concentration of boron in the grown borosilicate glass film is 3.4%;
[0073] The ...
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Abstract
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