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High-frequency tin soldering method

A high-frequency soldering and soldering technology, which is applied in the direction of tin feeding device, welding equipment, auxiliary device, etc., can solve the problems of high labor cost, uneven soldering amount, complex structure, etc., and achieve the goal of improving soldering quality without structural restrictions, High practical effect

Active Publication Date: 2019-04-16
广东大唐永恒智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Its disadvantages are: first, this soldering method requires both hands to operate, which is very inconvenient; second, in the process of melting tin wire in this soldering method, tin is easy to stick to the tip of the soldering iron, resulting in uneven solder volume , so that it is difficult to control the amount of tin wire; third, this traditional soldering method has high requirements on the technical level of the operator, resulting in high labor costs; The solder wire feeding structure is set next to the head. The structure is complicated and the volume is large, which makes it impossible to realize simultaneous soldering of multiple sets of soldering devices in a small space, reducing the automation effect

Method used

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Examples

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Embodiment 1

[0054] figure 1 Schematically shows a soldering method according to an embodiment of the present invention, including a high-frequency soldering system, the high-frequency soldering system includes a tin feeding device 1, a soldering device 2 and a control device 3, and the tin feeding device 1 passes through the pipeline and the soldering device 2, the control device 3 is electrically connected with the tin feeding device 1 and the soldering device 2, and the power source of the tin feeding device 1 is compressed air; and includes the following steps.

[0055] S1. Parameter setting: set the soldering parameters at the control device 3;

[0056] S2, tin feeding: the solder end of the soldering device 2 is aligned with the solder joint, and triggers the tin feeding function of the tin feeding device 1, and the tin feeding device 1 transports the tin wire to the soldering device 2;

[0057] S3. Soldering: the tin wire enters the soldering device 2, and the soldering device 2 me...

Embodiment 2

[0103] to combine Figure 12-14 , this embodiment is substantially the same as Embodiment 1, the difference is that the heating pipe 24313 and the insulating sheet 24312 in the embodiment are detachably connected, while the heating pipe 24313 and the insulating sheet 24312 are fixedly connected in this embodiment. Moreover, the second feeding tube 242 in the soldering mechanism 24 of this embodiment cancels the structure of the installation tube 2421 at the lower end. In this embodiment, the second feeding tube 242 is fixedly sleeved in the heating tube 24313 . Also be provided with following structure in the present embodiment:

[0104] In this embodiment, the middle part of the heating element 2431 and the non-stick tube 2433 are both provided with the same turning section 2434 . During the conveying process of the tin wire, the turning section 2434 can block the tin wire, and the tin wire contacts the inner wall of the non-stick tube 2433 and is melted rapidly, increasing ...

Embodiment 3

[0111] to combine Figure 1-13 and Figure 15 , the present embodiment is roughly the same as the soldering method of embodiment one and embodiment two, and its difference is as follows:

[0112] In order to improve the soldering efficiency, before each soldering device 2 solders tin, a small section of tin wire can be reserved in the discharge pipe 135 in the tin feeding device 1 for use by the soldering device 2.

[0113] S1. Parameter setting: set the soldering parameters at the control device 3, the soldering parameters include temperature, amount of tin, etc.

[0114] S2. Tin delivery: align the nozzle 24332 of the soldering device 2 with the solder joint, align the nozzle 24332 with the solder joint and squeeze it downward, so that the solder mechanism 24 pushes the jacking tube 223, and the jacking tube 223 touches the micro switch 221, and the micro switch 221 The dynamic switch 221 triggers the tin feeding function of the tin sending mechanism in the form of an elec...

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Abstract

The invention discloses a high-frequency tin soldering method which is characterized in that a tin conveying device, a tin soldering device and a control device are involved; the tin conveying deviceis connected with the tin soldering device through a pipeline; the control device is electrically connected with the tin conveying device and the tin soldering device; and compressed air is adopted asa power source of the tin conveying device. The high-frequency tin soldering method comprises the following steps: S1, parameter setting: tin soldering parameters are set at the control device; S2, tin conveying: the tin soldering end of the tin soldering device is aligned with a soldering spot, the tin conveying function of the tin conveying device is triggered, and a tin wire is conveyed by thetin conveying device into the tin soldering device; and S3, tin soldering: the tin wire enters the tin soldering device and is molten by the tin soldering device, and the tin wire being in the moltenstate is soldered onto the soldering spot. According to the high-frequency tin soldering method provided by the invention, the control device is utilized for the parameter control of the tin conveying device and the tin soldering device, so that during the whole tin soldering process, the accurate control of the tin soldering amount, the tin soldering time and the tin soldering temperature can befacilitated, and the tin soldering quality can be improved.

Description

technical field [0001] The invention relates to a soldering method, in particular to a high-frequency soldering method. Background technique [0002] In the traditional soldering technology, electric soldering iron and solder wire are generally used to weld electronic components or wires to the circuit board, or to weld multiple wires together. This welding method needs to melt the wire first, and then use liquid tin to seal the pad. Solder with pins and wires. [0003] Its disadvantages are: first, this soldering method requires both hands to operate, which is very inconvenient; second, in the process of melting tin wire in this soldering method, tin is easy to stick to the tip of the soldering iron, resulting in uneven solder volume , so that it is difficult to control the amount of tin wire; third, this traditional soldering method has high requirements on the technical level of the operator, resulting in high labor costs; The solder wire feeding structure is set next t...

Claims

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Application Information

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IPC IPC(8): B23K1/002B23K3/00B23K3/06B23K3/08
CPCB23K1/002B23K3/00B23K3/063B23K3/08
Inventor 姚晓乌冯满新黎涛
Owner 广东大唐永恒智能科技有限公司
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