Unlock instant, AI-driven research and patent intelligence for your innovation.

Light-emitting packaging structure and manufacturing method thereof and composite substrate

A technology of composite substrate and packaging structure, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of light-emitting diode packaging that is difficult to control the amount of solder, and it is difficult to control the overflow of solder, and achieve the effect of reducing bad situations and controlling the amount of solder

Pending Publication Date: 2021-03-12
LITE ON OPTO TECH (CHANGZHOU) CO LTD +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to solve the defects that it is difficult to control the amount of solder and the overflow of solder in the existing light-emitting diode package

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting packaging structure and manufacturing method thereof and composite substrate
  • Light-emitting packaging structure and manufacturing method thereof and composite substrate
  • Light-emitting packaging structure and manufacturing method thereof and composite substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following is an illustration of the implementation of the "light-emitting packaging structure and its manufacturing method and composite substrate" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Heightaaaaaaaaaa
Login to View More

Abstract

The invention discloses a light-emitting packaging structure comprising: a composite substrate which is provided with a substrate body and a solder mask layer, wherein the substrate body is provided with a chip mounting surface, the chip mounting surface is provided with a plurality of die bonding areas, each die bonding area is provided with a first electrode and a second electrode, the solder mask layer is arranged on the chip mounting surface, and the top surface of the solder mask layer is higher than the top surfaces of the first electrode and the second electrode; a plurality of hollowed-out parts which are arranged on the solder mask layer and correspond to the plurality of die bonding areas, wherein each hollowed-out part is provided with an annular side wall and a bottom plane part, the annular side walls surround the die bonding areas, and the top surfaces of the first electrode and the second electrode are exposed out of the bottom plane parts; and a plurality of light emitting chips arranged in the plurality of die bonding areas and welded to the first electrode and the second electrode. The invention further discloses a packaging method of the light-emitting packagingstructure and a composite substrate.

Description

technical field [0001] The invention relates to a light-emitting packaging structure, a manufacturing method thereof, and a composite substrate, in particular to a light-emitting packaging structure, a manufacturing method thereof, and a composite substrate applied to light-emitting chip packaging. Background technique [0002] The existing light-emitting package structure that adopts flip-chip packaging needs to solder the light-emitting chip to the pad of the substrate by soldering. As light-emitting diodes are developing in the direction of miniaturization, when the size of the chip is reduced, the bonding area of ​​the chip pad and the spacing between the pads are also reduced, so the requirements for soldering precision are increased, and the solder overflow in the reflow process control is also more stringent. [0003] Especially in the current technical field of Mini LED or MICRO LED, the size of light-emitting diodes is reduced, and the arrangement density of chips ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/62H01L25/075H01L33/54
CPCH01L33/62H01L25/0753H01L33/54H01L2933/0066H01L33/486H01L2933/005H01L2924/12041H01L2224/16227H01L2224/81815H01L2224/10175H01L24/13H01L24/16H01L2924/181H01L24/81H01L2224/16237H01L2224/131H01L2924/00014H01L2924/014H01L24/08H01L2224/80395H01L2224/08225H01L2224/0801H01L2224/80815H01L24/80
Inventor 林贞秀陈志源
Owner LITE ON OPTO TECH (CHANGZHOU) CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com