Heat storage/cold storage type double-pass semiconductor air conditioning device

Abstract

The invention discloses a heat storage / cold storage type double-pass semiconductor air conditioning device, and belongs to the field of semiconductor air conditioners. The heat storage / cold storage type double-pass semiconductor air conditioning device comprises semiconductor refrigerating units, heat exchanging units, a ventilator and a power source controller. A heating / refrigerating machine core is separated into an upper layer and a lower layer which are of a same structure, air inlets are formed between heat exchanging pieces of the first heat exchanging unit of the lower layer, air outlets are formed between heat exchanging pieces of the first heat exchanging unit of the upper layer, the ventilator is arranged at the air outlets, and air enters from the air inlets and passes througha returning groove and is discharged from the air outlets through the ventilator. According to the heat storage / cold storage type double-pass semiconductor air conditioning device, the refrigeratingcapacity or the heating capacity of the semiconductor refrigerating units are absorbed through the heat exchanging units and a thermal storage material, when the environment needs to be refrigerated,the heating capacity released by the semiconductor refrigerating units is absorbed by the thermal storage material, and when the environment needs to be heated, the refrigerating capacity released bythe semiconductor refrigerating units is absorbed by the thermal storage material. According to the semiconductor refrigerating units, the positive pole and the negative pole of a direct current supply are converted, switching between refrigerating and heating is realized. The returning groove effectively increases the heat exchanging area and time, and the refrigerating or heating efficiency is improved.

Description

technical field [0001] The invention relates to a heat storage / cool storage type double-flow semiconductor air conditioner, which belongs to the field of semiconductor air conditioners. Background technique [0002] In the hot summer, the indoor temperature is high, which seriously affects people's work efficiency and quality of life. In order to obtain a comfortable environment, a compression air conditioner is usually used for cooling. However, compression air conditioners have large volume, many components, high cost, and poor portability. These factors limit the application of compression air conditioners in various occasions. In some office buildings, classrooms, student dormitories, and even private houses, air-conditioning equipment is far from popular. Similarly, in the cold winter, especially in southern China, the indoor temperature is low due to the lack of central heating, and there is a lack of safe and fast heating methods in places and areas where compressio...

AI Technical Summary

Problems solved by technology

However, due to its low performance coefficient, a large amount of heat (cooling capacity) is also generated while cooling (or heating). If the heat (or cooling capacity) is lost indoors, it will not be able to cool down (or heat up) the room. , it will also increase (or decrease) the indoor temperature, which seriously limits the wide application of semiconductor air conditioners

In addition, in the traditional semiconductor air conditioning system, due to the limited contact area between the air and the cooling surface (or heating surface), this greatly limits the rapid cooling (or heating) of the air

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