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Illumination device used for object inspection

A technology for lighting equipment and objects, which is applied in the direction of optical testing of flaws/defects, material analysis through optical means, and measuring devices. easy-to-achieve effects

Inactive Publication Date: 2019-04-16
INTEL PROD CHENGDU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, when the above-mentioned abnormalities exist in the chip socket, it may cause quality problems in a large number of semiconductor chips, resulting in yield loss
[0003] In the prior art, quality problems caused by abnormal equipment components cannot be detected by inspection tools until the products processed by the abnormal equipment components reach a specific inspection process
However, by the time the inspection tools detected these quality problems, a large number of products had been processed by abnormal equipment parts
Therefore, because the existing technology cannot detect the abnormality of the equipment components in time, the yield has been lost when the equipment components are found to be abnormal.

Method used

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  • Illumination device used for object inspection
  • Illumination device used for object inspection
  • Illumination device used for object inspection

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Embodiment Construction

[0047] The subject matter described herein will be discussed below with reference to example implementations. It should be understood that the discussion of these implementations is only to enable those skilled in the art to better understand and realize the subject matter described herein, and is not intended to limit the protection scope, applicability or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as needed. Additionally, features described with respect to some examples may also be combined in other examples.

[0048] As used herein, the term "comprising" and its variants represent open terms meaning "including but not limited to". The term "based on" means "based at least in part on". The terms "one embodiment" and "an embodiment" mean "at least one embodiment." The term "anoth...

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Abstract

The invention relates to the object inspection technology field and especially relates to an illumination device used for object inspection. The illumination device comprises a curved surface light cover and a plurality of monochromatic visible light sources, wherein the curved surface light cover has a concave curved surface which is arranged to face an object to be inspected; the plurality of monochromatic visible light sources are arranged on the concave curved surface of the curved surface light cover and are used for irradiating the object to be inspected; and the positions of the plurality of monochromatic visible light sources and the shape of the concave curved surface can make irradiation light formed by monochromatic visible light emitted by the plurality of monochromatic visiblelight sources in a predetermined illumination range irradiate the object to be inspected, and the illumination deviation of the irradiation light does not exceed 10%. The illumination device can irradiate the object to be inspected so as to acquire a clear object image, and whether the object to be inspected is abnormal can be determined based on the object image.

Description

technical field [0001] The present disclosure relates to the technical field of object inspection, and in particular, to a lighting device for object inspection. Background technique [0002] In the semiconductor manufacturing process, abnormal factors such as damage, foreign matter, and deformation on equipment components will have an impact on the quality of semiconductor products being processed. For example, when testing a semiconductor chip, a chip socket is used, and the chip socket is used to insert the chip to test it. When the pins (Pin) of the chip socket are damaged, foreign objects, deformed, burned and other abnormalities, it may cause quality problems such as indentations on the substrate, leads, solder balls, etc. of the chip. A large number of semiconductor chips can be plugged into the same chip socket. Therefore, when the above-mentioned abnormality exists in the chip socket, quality problems may occur in a large number of semiconductor chips, thereby res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/88G01N21/95
CPCG01N21/8806G01N21/95G01N2021/8812
Inventor 杨维平程泽
Owner INTEL PROD CHENGDU CO LTD
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